Metal Shield SMD Image Collector

Abstract

The invention discloses a patch image collector with a metal shielding cover, which includes a lens module and a shielding cover. A lighting hole is formed at the top of the shielding cover, and an opening is arranged at the bottom end of the shielding cover. A hole for installing the lens module is formed in the middle of the shielding cover. Cavity, the lens module includes a lens and a photosensitive chip, the cavity includes an upper cavity for accommodating the lens, and a lower cavity for accommodating the photosensitive chip. The chips are pasted together, and the bottom of the shield extends downward to form several tin patches, and the photosensitive chip is an image sensor or a CMOS image sensor. The invention not only realizes the shielding and protection of the lens module, so that the lens module will not be disturbed by external light, but also can withstand a certain external force collision, and realizes the integrated packaging of the lens module, which has good consistency and is convenient Batch SMD production, but also play the role of no glue, no oil injection, no focusing and light leakage prevention.

Description

technical field [0001] The invention relates to a camera lens module, in particular to a metal shield patch image collector with a metal shield. Background technique [0002] Now that color-screen mobile phones have become popular, the camera function of mobile phones has become the first choice for people to buy mobile phones. The connection between the lens of the camera lens module and the CMOS photosensitive chip, and the connection between the CMOS photosensitive chip and the circuit board are the key parts of the entire camera. A traditional camera module is basically composed of a lens assembly (lens), a base (holder), a photosensitive chip (CCD (Charge Coupled Device, charge-coupled device) or CMOS (Complementary Metal-Oxide-Semiconductor, Complementary Metal Oxide Semiconductor)) , circuit board and connector, the lens assembly corresponds to the photosensitive area of ​​the photosensitive chip through the base, and is assembled on the circuit board together, but th...

AI Technical Summary

Problems solved by technology

This traditional lens assembly has the following disadvantages: firstly, the thread fit between the lens barrel and the lens holder is not well controlled, and the defect rate is high in the lens production and assembly process; secondly, the use of this lens holder requires manual adjustment of the focal length, manual The cost is high; again, in the process of adjusting the focal length, if the dirt particles in the thread fall on the surface of the CMOS photosensitive chip, it will cause black shadows on the image, reducing the reliability and yield of the product; in addition, the lens mount and circuit The board is positioned through the positioning column and the positioning hole. It requires a hot pressing process to pre-fix the lens holder and the circuit board, which not only increases the time and material costs, but also the fixing effect of the entire lens is not very good. Interference with external light

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