Automatic soldering device and conveying device

Abstract

The invention provides an automatic soldering device and a carrier device. A board is affixed to a predetermined position and can be carried to a soldering processing portion. An automatic soldering device is provided with a carrier pawl (10) for holding a printed board (W1), carrier chains (15a, 15b) for driving the carrier pawl (10) from a heater portion (4) to a solder bath (5), a first frame (9A) for guiding the carrier chains (15a, 15b) along the heater portion (4), a second frame (9B) for guiding the carrier chains (15a, 15b) along the solder bath (5), and an absorbing member (124) which is provided between the frame (9A) and the frame (9B) so as to absorb the expansion and contraction caused by the difference of the thermal expansion between the frames (9A, 9B) and the carrier chains (15a, 15b). The absorbing member (124) absorbs the expansion and contraction caused by the difference of the thermal expansion between the frames (9A, 9B) and the carrier chains (15a, 15b), thus making it possible to prevent the carrier chains (15a, 15b) from being shifted from the frames (9A, 9B). As a result, the printed board (W1) is affixed to the predetermined position and can be carried to the heater portion (4) and the solder bath (5).

Description

technical field [0001] The present invention relates to an automatic soldering device and a conveying device for conveying printed circuit boards and the like to a solder processing unit for soldering. Background technique [0002] Generally, in order to mass-produce printed circuit boards incorporated in home appliances such as display devices such as televisions and recording and reproducing devices such as video recorders at low cost, the printed circuit boards are often soldered by the flow method. The method refers to the method of soldering using pre-melted solder (brazing filler metal). [0003] Since the flooding method can solder the entire surface of the printed circuit board at one time, the flooding method is a soldering method suitable for mass production compared with other soldering methods. The automatic soldering equipment for soldering by the flood method is equipped with various processing devices such as pre-heaters, solder tanks, and coolers. In these ...

AI Technical Summary

Problems solved by technology

[0005] However, in this automatic soldering device, there is a problem that the conveyance part is heated for the preheating process performed by the preheater and the solder adhesion process performed by the solder tank, and thermal expansion of the chain and the frame constituting the conveyance part The difference between the two leads to expansion and contraction, and the position of the printed circuit board conveyed by the conveying part is misaligned from the specified position.

Therefore, there is a problem that the substrate cannot be reliably fixed at a predetermined position and transported to the solder processing section.

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