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Rotary cleaning device

A technology for cleaning devices and cleaning liquids, applied in cleaning methods and appliances, cleaning methods using liquids, electrical components, etc., capable of solving problems such as quality reduction of imaging devices and other devices

Active Publication Date: 2016-02-10
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the conventional spin cleaning apparatus, there is a problem that when the wafer is dried by high-speed rotation of the rotary table after cleaning, deposits ( 油み), the mist-like pollutants suspended in the sediment fall and adhere to the surface of the dried wafer, thereby deteriorating the quality of devices such as imaging devices

Method used

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Embodiment Construction

[0020] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , shows a perspective view of a cutting device (cutting device) 2 having a rotary cleaning device according to an embodiment of the present invention.

[0021] On the front surface side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT (Cathode Ray Tube: Cathode Ray Tube) is provided on the upper part of the device for displaying a guidance screen for an operator and an image captured by an imaging unit described later.

[0022] Such as figure 2 As shown, on the surface of the wafer W to be cut, the first street S1 and the second street S2 are formed orthogonally, and a large number of imaging devices D such as CCD and CMOS are separated by the first street S1 and the second street S1. S2 is formed on wafer W by division....

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PUM

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Abstract

The invention provides a rotary cleaning device. The rotary cleaning device comprises a rotary workbench which absorbs and holds a wafer and rotates; a cleaning fluid supply member; a cleaning fluid receiving container with the annular outer peripheral sidewall, the annular inner peripheral sidewall and the bottom wall that surround the rotary workbench; a driving member which moves the cleaning fluid supply member between a cleaning position and a retreating position; and an exhaust member in connection with the bottom wall of the cleaning fluid receiving container. The rotary cleaning device is characterized in that the cleaning fluid supply member comprises a rotating shaft connected with the driving member, an arm which is integratedly connected with the rotating shaft and is elongated along the horizontal direction, and a cleaning fluid nozzle which is formed at the end of the arm to spray the cleaning fluid towards the wafer held by the rotary workbench; the annular outer peripheral sidewall forms a receiving opening portion for receiving the cleaning fluid supply member when the cleaning fluid supply member is positioned at the retreating position; and the cleaning fluid supply member is equipped with a seal cover, which seals the receiving opening portion when the cleaning fluid supply member is received in the receiving opening portion.

Description

technical field [0001] The present invention relates to a spin cleaning device for cleaning a wafer such as a semiconductor wafer while supplying a cleaning liquid while rotating the wafer. Background technique [0002] For a semiconductor wafer on which multiple imaging devices such as CCD (Charge-coupled Device: Charge-coupled Device) and CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor) are formed, the back surface is ground by a grinding device to form a predetermined thickness. It is divided into individual imaging devices by a cutting device (cutting device), and the divided imaging devices are widely used in electrical equipment such as digital cameras, video cameras, and mobile phones. [0003] If dust adheres to the surface of imaging devices such as CCD and CMOS, it will partially reduce the imaging function and cause quality deterioration. Therefore, the wafer that is divided into individual imaging devices and attached to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00B08B3/02
Inventor 香西宏彦山村英司
Owner DISCO CORP