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Method for realizing high-precision gray scale exposure by scanning

A high-precision, gray-scale technology, applied in micro-lithography exposure equipment, photolithography process exposure devices, optics, etc., can solve the problems of long time-consuming, expensive, and high manufacturing costs of traditional wafer lithography, and achieve improved control accuracy and effective modulation effect

Active Publication Date: 2013-11-06
TIANJIN JINXIN MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These reticles are expensive and time consuming to produce due to the reduced feature size and the need for precise tolerances for smaller feature sizes, making traditional wafer lithography manufacturing using reticles more expensive. Comes tall and very expensive

Method used

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  • Method for realizing high-precision gray scale exposure by scanning
  • Method for realizing high-precision gray scale exposure by scanning

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Embodiment Construction

[0016] like figure 1 shown. The light beam 2 emitted by the light source 1 reaches the spatial light modulator 3 through the optical path, and becomes a light beam 4 opposite to the pattern on the spatial light modulator 3 after being reflected by the spatial light modulator 3. The light beam reaches the surface of the substrate 5 to be exposed through the optical path, and is used The chemical reaction transfers the pattern to the surface of the substrate 5 to be exposed. The scanning exposure system refers to the relative movement between the graphics on the spatial light modulator 3 and the substrate to be exposed 5, the movement direction 6 of the substrate to be exposed and the movement direction 7 of the graphics on the spatial light modulator 3, to achieve the exposure of the entire substrate to be exposed. The purpose of base 5.

[0017] like figure 2 shown. figure 2 The scanning exposure process for realizing 1024 gray levels is illustrated. A among the fi...

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Abstract

The invention discloses a method for realizing high-precision gray scale exposure by scanning, which comprises a maskless photolithographic system using a spatial light modulator (SLM) as a pattern generator; each of 1024 micro-mirrors in a row is realized to represent one gray scale in a direction of the scanning motion in the spatial light modulator by FPGA, that is, a gray scale of 1024 grades is realized; during the scanning exposure of a substrate, the substrate is controlled by a precision stage to move uniformly along the direction of the scanning motion; the micro-mirrors in a row in the direction of the scanning motion in the spatial light modulator turn over orderly from start to end with a same time interval of unit time; the unit time is the time required for the substrate to move in a distance of one micro-mirror. After the substrate scans a row of 1024 micro-mirrors, the gray scales passing through the 1024 micro-mirrors is combined and accumulated, and high-precision gray scale exposure is realized.

Description

technical field [0001] The invention relates to the field of exposure control of a direct-writing photolithography machine, in particular to a method for realizing high-precision grayscale exposure through scanning. Background technique [0002] Traditional step-and-repeat or step-scan lithography tools used in the semiconductor industry project or scan the feature pattern of the reticle onto the wafer in each field at a time, exposing or scanning one field at a time. The exposure process is then repeated for the next field by moving the wafer. Traditional photolithography systems enable high-throughput printing of precise feature patterns through repetitive exposure or scanning processes. [0003] In order to fabricate devices on a wafer, multiple reticles are required. These reticles are expensive and time consuming to produce due to the reduced feature size and the need for precise tolerances for smaller feature sizes, making traditional wafer lithography manufacturing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G02B26/10
Inventor 李显杰彭丹花
Owner TIANJIN JINXIN MICROELECTRONICS TECH CO LTD