Ant nest-like heat dissipation material and heat dissipation device prepared from the ant nest-like heat dissipation material
A heat-dissipating material and nest-like technology, which is applied in the field of ant nest-like heat-dissipating materials and heat-dissipating devices prepared by using it, can solve the problems of complex preparation process and poor performance of heat-dissipating materials, and achieve the advantages of simple process and low material consumption Effect
Inactive Publication Date: 2012-02-01
中山市尔全照明有限公司
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Problems solved by technology
[0003] The purpose of the present invention is to overcome the defects of poor heat dissipation material performance and complicated preparation process in the prior art
Method used
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Embodiment
[0018] The heat dissipation material of this embodiment is produced by a method comprising the following steps: take elemental gold, and prepare particles with a diameter of 3 machmesh by a conventional process to obtain the heat dissipation material.
[0019] The heat sink prepared by using the heat dissipation material prepared in this embodiment was compared with the solid copper heat sink of the same size. When using the heat dissipation material prepared in this embodiment to prepare a heat sink, just pour the heat dissipation material into a mold, sinter or hot press, so that the surface of the particle part is fused and there are gaps between adjacent particles, which is simple and easy. like figure 2 As shown, a 3W LED light source 1 is lit (input: 700mA) at the center of the heat sink, where the position 2 is the negative pole of the light source, and the position 3 is the positive pole of the light source. After lighting for 2 hours, test the diagrams respectively ...
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The invention relates to an ant nest-like heat dissipation material and a heat dissipation device prepared from the ant nest-like heat dissipation material. The ant nest-like heat dissipation material belongs to the technical field of heat dissipation materials. A preparation method of the ant nest-like heat dissipation material comprises that a simple substance, a compound or a mixture with a thermal coefficient great than or equal to 1.0w / m-k is prepared into irregular particles. A method for preparing the heat dissipation device from the ant nest-like heat dissipation material comprises the following steps of pouring the ant nest-like heat dissipation material into a mold, and carrying out sintering or hot pressing to realize fusion of particle parts, wherein there is a gap between each two adjacent particles. The method for preparing the heat dissipation device from the ant nest-like heat dissipation material has the advantages of simple processes and low raw material consumption, wherein a utilization rate of raw materials can reach 30%. The heat dissipation device prepared from the ant nest-like heat dissipation material is not limited by a set angle, can carry out heat dissipation at any angle because of the gap between each two adjacent irregular particles, and has a good heat dissipation effect, wherein a heat dissipation rate of the heat dissipation device is above 15% higher than a heat dissipation rate obtained by other heat dissipation methods.
Description
technical field [0001] The invention belongs to the technical field of heat dissipation materials, and in particular relates to an ant nest-like heat dissipation material and a heat dissipation device prepared using the heat dissipation material. Background technique [0002] Part of the electric energy consumed by light-emitting diodes (LEDs) during work will be converted into light, and the rest of the electric energy will be converted into heat and dissipated. The heat generated by the LEDs will cause the temperature of the LEDs to rise rapidly. If the heat is not dissipated in time, the components will Continuous heating will first cause light decay, and if it continues, the phosphor will deteriorate, change the color temperature and light decay, and finally the ionospheric light-emitting layer of the light-emitting diode will be burned and the light will die. In the prior art, the heat dissipation devices used in high-power LEDs all use solid plates or pipes. In order t...
Claims
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IPC IPC(8): C09K5/14B22F3/02B22F3/11H01L23/373H01L33/64
Inventor 吴金益吴建锡吴彰家李巧巧
Owner 中山市尔全照明有限公司