Wafer cleaning and drying machine

Abstract

The invention provides a wafer cleaning and drying machine. The wafer cleaning and drying machine comprises a fixing device, a water sprayer, a rotating device, an upper shield, a water distribution shield and a blowing device, wherein the fixing device is used for clamping a wafer; the water sprayer is used for spraying water to the wafer so as to wash the surface of the wafer; the rotating device drives the fixing device to rotate so as to throw away the water on the wafer; the upper shield is arranged above the fixing device and can prevent the water thrown out of the wafer from arbitrarily splashing above the wafer; the water distribution shield is arranged above the wafer and is used for guiding out the water which is upward thrown out of the wafer; and the blowing device is arrangedbelow the upper shield and can prevent the water from falling back to the wafer. The wafer cleaning and drying machine has the beneficial effects that the blowing device can prevent the water thrown out of the wafer from falling back to the wafer so as to avoid water stains on the washed wafer surface, thus meeting the requirements for high-quality processing.

Description

technical field [0001] The invention relates to the technical field of integrated circuit processing, in particular to a wafer cleaning and drying machine which rinses wafers with deionized water and realizes the drying function. Background technique [0002] In the integrated circuit processing technology, there are steps for cleaning the wafer. Specifically, after chemical mechanical polishing, some residues or dust often fall on the surface of the wafer. This kind of dust defect (P / D, Particle Defect) can be removed by brushing to avoid affecting the yield. There are usually the following five different scrubbing methods: deionized water scrubbing, brush scrubbing, high-pressure water scrubbing, brush plus high-pressure water scrubbing, and chip double-sided scrubbing. [0003] After the chemical mechanical polishing process, the existing wafer rinser and dryer (SRD) for rinsing the wafer with deionized water, such as Figure 1a As shown, its structure includes: under th...

AI Technical Summary

Problems solved by technology

[0004] But, in the above-mentioned wafer cleaning process, a small part of the deionized water thrown out from above the wafer and falling on the upper cover 101 will also directly fall back on the wafer 102, thereby forming water spots on the wafer. , affecting subsequent processing

Images