High-power LED packaging structure

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve problems affecting LED brightness and service life, and achieve the effects of saving materials, short heat conduction paths, and reducing costs

Inactive Publication Date: 2012-02-29
SOUTH CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

LED heat dissipation has become a bottleneck in LED applications, because it seriously affects the brightness of LEDs and the service life of LEDs

Method used

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  • High-power LED packaging structure

Examples

Experimental program
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Effect test

Embodiment Construction

[0030] refer to Figure 1 to Figure 3 As shown, the present invention provides a preferred embodiment of the high-power LED packaging structure, but the embodiment of the present invention is not limited thereto.

[0031] Such as figure 1 As shown: the heat dissipation substrate 11 has a square-shaped protrusion 113 at the center, and the LED chip 7 is fixed on the protrusion 113 through the die-bonding glue 6 . There is an adhesive layer 2 and a circuit layer 3 on the heat dissipation substrate 11 . When the heat dissipation substrate 11 is an insulating material, such as co-fired ceramics, the adhesive layer 2 can be conductive, and when the heat dissipation substrate 11 is conductive, such as copper, the adhesive layer 2 is also an insulating layer. There is a hole in the center of the adhesive layer 2 and the circuit layer 3, and the size of the hole matches the size of the protrusion 113. The heat emitted by the LED chip 7 on the protrusion 113 does not pass through the...

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PUM

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Abstract

The invention discloses a high-power LED packaging structure which is characterized by comprising a heat radiating substrate, an LED chip, a lens and a circuit layer, wherein the upper surface of the heat radiating substrate is provided with a bulge; the LED chip is installed on the bulge on the upper surface of the heat radiating substrate; the circuit layer is stuck to the upper surface of the heat radiating substrate through a bonding layer and is provided with an internal electrode and an external electrode connected with a power supply, the internal electrode is arranged at the edge of a hole, and a lead of the LED chip is connected with the internal electrode; the lens is arranged above the LED chip; and the structure ensures that the LED chip directly radiates heat to the air through the substrate which simultaneously has a heat sink function so that the junction temperature of an LED can be effectively reduced. The packaging structure reduces the heat resistance of the entire heat transferring process, can be used for heat radiation of high-power LEDs and realization of efficient illumination and is simple in process and easy to manufacture.

Description

technical field [0001] The invention relates to the technical field of LED chip packaging, in particular to a high-power LED packaging structure. Background technique [0002] LED light sources have become the best light source choice to replace traditional lighting sources because of their low driving voltage, high luminous flux, long life, small structure, safety, high efficiency, and energy saving. However, with the gradual application of high-power LEDs in street lamps, automobile lamps, indoor lighting and liquid crystal displays. LED heat dissipation has become a bottleneck in LED applications, because it seriously affects the brightness of LEDs and the service life of LEDs. [0003] For example, when the p-n junction temperature (Junction Temperature) of the LED is 25°C (typical operating temperature), the brightness is 100, and when the temperature rises to 75°C, the brightness is reduced to 80, 60 to 125°C, and 175°C Only 40 left. Obviously, there is an inverse l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L25/075
CPCH01L2224/73265
Inventor 姚光锐范广涵郑树文张涛龚长春许毅钦贺龙飞
Owner SOUTH CHINA NORMAL UNIVERSITY
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