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Process method for preparing tantalum nitride coating on surface of commemorative coin die

A process method, tantalum nitride technology, is applied in the field of surface strengthening treatment of commemorative coin molds, which can solve the problems of low production efficiency and short service life, and achieve the effect of improving production efficiency and prolonging service life

Active Publication Date: 2014-07-23
CHINA BANKNOTE PRINTING & MINTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It solves the problems of short service life and low production efficiency of commemorative coin molds in the prior art, and has no environmental pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] ① Surface treatment of the mold by nitrogen plasma-based ion implantation. The gas is high-purity nitrogen with a purity of 99.999%, the nitrogen plasma is excited by radio frequency, the injection voltage is 60kV, and the injection dose is 3×10 17 ion / cm 2 ②Heating the above-mentioned surface-treated mold to raise the temperature of the mold to 200°C; ③For the above-mentioned heated mold, deposit a layer of tantalum film with a thickness of 30nm on the surface of the mold by magnetron sputtering; Plasma-based ion implantation treatment to form a tantalum nitride layer, the implantation voltage is 45kV, and the implantation dose is 0.5×10 17 ion / cm 2 ; ⑤ Repeat steps ③ and ④ for a total of 40 times until a tantalum nitride coating with a thickness of 1.2 μm is obtained. The actual silver coin stamping results show that when the number of stamped silver coins reaches 600, the number of flash lines on the silver coin is significantly less than that of silver coins stam...

Embodiment 2

[0016] ① The surface treatment of the mold is carried out by nitrogen plasma-based ion implantation. The gas is high-purity nitrogen gas with a purity of 99.999%, and the nitrogen plasma is excited by radio frequency. The implantation voltage is 60kV and the implantation dose is 5×10 17 ion / cm 2 ②Heating the above-mentioned surface-treated mold to raise the temperature of the mold to 300°C; ③For the above-mentioned heated mold, deposit a layer of tantalum film with a thickness of 100nm on the surface of the mold by magnetron sputtering; ④Take the above-mentioned tantalum film Plasma-based ion implantation treatment to form a tantalum nitride layer, the implantation voltage is 60kV, and the implantation dose is 1×10 17 ion / cm 2 ; ⑤ Repeat steps ③ and ④ for a total of 20 times until a tantalum nitride coating with a thickness of 2 μm is obtained. The actual copper coin imprinting results show that when the hard-plated Cr-plated mold reaches about 2000 pieces, the surface flash...

Embodiment 3

[0018] ① Carry out nitrogen plasma-based ion implantation surface treatment on the mold. The gas is high-purity nitrogen with a purity of 99.999%. The nitrogen plasma is excited by radio frequency. The implantation voltage is 60kV and the implantation dose is 4×10 17 ion / cm 2 ②Heating the above-mentioned surface-treated mold to raise the temperature of the mold to 250°C; ③For the above-mentioned heated mold, deposit a layer of tantalum film with a thickness of 50nm on the surface of the mold by magnetron sputtering; Plasma-based ion implantation treatment to form a tantalum nitride layer, the implantation voltage is 60kV, and the implantation dose is 1×10 17 ion / cm 2 ; ⑤ Repeat steps ③ and ④ for a total of 30 times until a tantalum nitride coating with a thickness of 1.5 μm is obtained. The actual silver coin stamping results show that when the number of stamped silver coins reaches 600, the number of flash lines on the silver coin is significantly less than that of silver c...

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Abstract

The invention relates to a process method for preparing a tantalum nitride coating on the surface of a commemorative coin die and belongs to a technology of reinforcing the surface of the commemorative coin die and prolonging the service life of the commemorative coin die. The process method comprises the following process steps of: 1, carrying out nitrogen plasma-based ion implantation surface treatment on the die; 2, heating the die to a temperature of 200 to 300 DEG C; 3, depositing a layer of tantalum film on the surface of the die by magnetron sputtering; 4, carrying out nitrogen plasma-based ion implantation treatment on the tantalum film to form a tantalum nitride layer; and 5, repeatedly carrying out the steps 3 and 4 until the tantalum nitride coating with a preset thickness is obtained. The process method has the advantages that no pollution is discharged in the production process; the surface glossiness and the size accuracy of the die are not changed; and low temperature deposition can be carried out. Moreover, the service life of the die is prolonged and the production efficiency of the die is improved.

Description

technical field [0001] The invention relates to a process method for strengthening the surface of a commemorative coin mold, in particular to a process method for preparing a tantalum nitride coating on the surface of a commemorative coin mold, which belongs to the technology of strengthening the surface of the commemorative coin mold and prolonging its life. Background technique [0002] Gold and silver commemorative coins are a special commodity, which has both artistry and the value preservation of gold and silver, and has a high collection value. Since gold and silver commemorative coins are works of art, compared with ordinary circulation coins, commemorative coins have higher requirements on surface quality. Flash line is the most common surface defect of gold and silver commemorative coins, which is characterized by some slender bright lines along the radial direction appearing on the edge of the commemorative coin. It is generally believed that the generation of flas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/04
Inventor 刘迪刘志刚赖茂明康今哲朱慕平唐光泽张吉刚孙志国马麟
Owner CHINA BANKNOTE PRINTING & MINTING
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