Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of composite ball for electronic device

A manufacturing method and technology for electronic devices, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of crushing solder balls, melting solder balls, short circuits, etc., and achieve the effect of suppressing unevenness

Active Publication Date: 2016-03-30
ACCURUS SCI
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such a package that attempts to increase density by stacking in the height direction is mounted using a BGA with solder balls, the solder balls may be crushed because the weight of the package itself cannot be supported.
This crushing of the solder balls may cause the solder balls to melt and cause a short circuit between the formed connection terminals, which will become an obstacle for high-density mounting

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of composite ball for electronic device
  • Manufacturing method of composite ball for electronic device
  • Manufacturing method of composite ball for electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] First, as core balls composed of spheres, 670,000 spheres were prepared in which the surface of Cu balls with a diameter of 200 μm was plated with Ni plating as an underlayer with a thickness of 2 μm. A methanesulfonic acid plating solution (pH 4) containing 22g / L of Sn and 1g / L of Ag was prepared as the plating solution, and a hexagonal prism with a diagonal length of 60mm and a width of 110mm was used as the plating device. A drum plating device with a rotating tank that rotates vertically on a horizontal axis. The rotating tank is immersed in a plating solution to form a solder plating layer. The plating conditions were set at a rotation speed of the rotary tank of 80 rpm and a current density of 0.15 A / dm 2 , electroplating was carried out for 6 hours only with rotation in one direction, a Sn-3%Ag (mass %) solder plating layer with a thickness of 25 μm was formed, and a composite was obtained.

[0046] Figure 5 The results of observing the appearance and cross-se...

Embodiment 2

[0056] After the complex was obtained under the same conditions as in Example 1, the resulting complex was all transferred to the same rotating tank that could rotate horizontally on a vertical axis as in Example 1, and then 4 liters of pure water (pH7) was added to carry out Rotation was carried out for 5 hours at a rotation speed of 500 rpm and a period of forward rotation and reverse rotation of 10 seconds, and smoothing was performed by bringing the composites into contact with each other without using a medium, thereby obtaining a composite ball for an electronic device.

[0057] image 3 The result of observing the appearance of an example of the composite ball for electronic devices obtained by smoothing the surface of the solder plating layer of the present invention with a scanning electron microscope is shown. like image 3 As shown, it was confirmed that even if the composite ball for electronic devices of the present invention is smoothed in pure water, the same s...

Embodiment 3

[0061] After obtaining the complex under the same conditions as in Example 1, the gained complex was all transferred to the same rotating tank that could rotate horizontally on a vertical axis as in Example 1, and then filled 58,000 ( 25 g) Cu spheres with a diameter of 450 μm. Then add 4 liters of methanesulfonic acid plating solution (pH4.0) containing 22g / L of Sn, 1g / L of Ag, and carry out 5 hours of rotating speed of 500rpm, forward rotation and reverse rotation cycle of 10 seconds, and implement smoothing. Chemical processing to obtain composite balls for electronic devices.

[0062] Figure 4 The result of observing the appearance of an example of the composite ball for electronic devices obtained by smoothing the surface of the solder plated layer of the present invention with a scanning electron microscope is shown. like Figure 4 As shown, it has been confirmed that the same as that obtained in Example 1 can be obtained by dropping into a medium and performing smoo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention aims to provide a manufacturing method for a compound ball for an electronic device, which is used for eliminating protrusions generated on a plated surface to obtain a smooth surface. The manufacturing method for the compound ball for the electronic device comprises the following steps: preparing a core ball formed by a ball body; subsequently, forming a soldering tin-plated layer in the manner of encircling the core ball to manufacture a compound body; and then, smoothening the surface of the soldering tin-plated layer. The smoothening is preferably performed in the manner that the surface of the soldering tin-plated layer is contacted with a medium.

Description

technical field [0001] The present invention relates to a method for manufacturing composite balls for electronic devices on which a solder plating layer is formed, used for connection terminals of surface array terminal packages typified by BGA (Ball Grid Array). Background technique [0002] In recent years, in order to meet the demand for high-density mounting of electronic devices, three-dimensional high-density mounting of package-on-package (POP), multi-chip module (MCM), and the like has been studied. When such a package, which is designed to increase density by stacking in the height direction, is mounted using a BGA with solder balls, the solder balls may be crushed because the weight of the package itself cannot bear it. Such crushing of the solder balls may lead to melting of the solder balls, resulting in a connection short circuit between the formed connection terminals, which will become an obstacle to high-density mounting. [0003] In order to solve the abov...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
Inventor 浅田贤
Owner ACCURUS SCI