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Backplane and liquid crystal display device

A backplane and sub-backplane technology, applied in the field of liquid crystal display, can solve problems such as lack of heat dissipation, increased cost, and large stamping equipment, and achieve the effects of improving display quality, reducing production costs, and improving flatness

Active Publication Date: 2016-12-14
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Large-sized products need to use larger stamping equipment, the cost is high, the corresponding mold size is large, the structure is complex, and the cost of the mold is also high
If the entire backplane is made of iron plate or plastic, heat dissipation elements need to be added, which increases the cost; if aluminum plate is used, no additional heat dissipation elements are used. Only a part of the plate plays the role of heat dissipation, and the other part does not play the role of heat dissipation but supports the role. Moreover, the price of the aluminum plate is relatively expensive, and the material cost is relatively high.

Method used

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  • Backplane and liquid crystal display device
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  • Backplane and liquid crystal display device

Examples

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0024] The applicant applied for a backplane for a backlight module, a backlight module, and a liquid crystal display device on October 12, 2011. The application number is 201110308489.5. This application discloses a backplane structure formed by a cooling plate and a supporting plate. The summary is as follows: a liquid crystal display device, including a backlight module, the bottom of the backlight module is provided with a back plate, which is used to support internal devices and seal the module, and provide necessary protection. The backplane of the backlight module includes a heat dissipation plate and a support plate connected with the heat dissipation plate; the thermal conductivity of the heat dissipation plate is greater than that of the support plate. The heat dissipation plate is made of a material with good heat dissipation, and h...

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PUM

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Abstract

The invention discloses a backplane and a liquid crystal display device. The backplane is formed by splicing at least two sub-backplanes. The splicing part of the sub-backplanes is provided with a plurality of vertical complementary parts perpendicular to the splicing section of the splicing part. Reinforcing ribs, the vertical reinforcing ribs are arranged along the splicing section. In the present invention, the backplane is formed by splicing multiple sub-backplanes without using large stamping equipment or large molds, thereby reducing the production cost of the backplane; in addition, the present invention uses multiple sub-backplanes for splicing, which can target The side with high heat generation on the backboard is made of materials with good heat dissipation performance, and for the side with low heat generation, only ordinary materials with sufficient strength are needed, which saves costs; At the joint, a number of vertical reinforcing ribs perpendicular to the joint section of the joint are added, which improves the strength of the joint and the vertical strength of the back plate, thereby improving the flatness of the back plate and improving the stability of the liquid crystal display device. Display quality.

Description

technical field [0001] The invention relates to the field of liquid crystal display, more specifically, to a back plate and a liquid crystal display device. Background technique [0002] The LCD modules currently in mass production all use integral backplanes. Generally, it is made of the same material, which is aluminum plate, iron plate or plastic, and the processing method is mostly stamping or plastic injection integral molding, which makes the product heavier and the material cost of the product is higher. Large-sized products need to use larger stamping equipment, the cost is high, the corresponding mold size is large, the structure is complex, and the mold cost is also high. If the entire backplane is made of iron plate or plastic, heat dissipation elements need to be added, which increases the cost; if aluminum plate is used, no additional heat dissipation elements are used. Only a part of the plate plays the role of heat dissipation, and the other part does not pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357
Inventor 周革革
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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