Silicon chip prealignment device and silicon chip prealignment method

Abstract

The invention discloses a silicon chip prealignment device. The silicon chip prealignment device comprises a rotating platform which is utilized for adsorbing a silicon chip and driving the silicon chip to rotate, an edge horizontal sensor which is utilized for acquiring horizontal position information of a silicon chip edge, an edge vertical sensor which is utilized for acquiring vertical position information of the silicon chip edge, and a controller which is utilized for synchronously controlling the rotating platform, the edge horizontal sensor and the edge vertical sensor. When the rotating platform rotates, the controller transmits synchronous trigger signals to the edge horizontal sensor and the edge vertical sensor, and the edge horizontal sensor and the edge vertical sensor acquire respective current measured values simultaneously and edge horizontal position information so that edge vertical position information can be acquired synchronously, wherein the current measured value which belongs to a measured point and is acquired by the edge vertical sensor is utilized for compensation of the current measured value which belongs to a silicon chip edge and is acquired by the edge horizontal sensor. Through the silicon chip prealignment device, all horizontal measured values of a silicon chip edge can be obtained when a silicon chip makes a round, and thus an eccentric value and a gap direction of the silicon chip can be determined. The invention also provides a silicon chip prealignment method.

Description

technical field [0001] The invention relates to the field of photolithography, in particular to a silicon chip pre-alignment device and method for a photolithography machine. Background technique [0002] During the production process of the lithography machine, the silicon wafer needs to be transferred to the workpiece table with high centering and orientation accuracy through the silicon wafer transmission mechanism. Since the position and direction of the silicon wafer are uncertain when placed in the wafer slot, it is necessary to pre-align the silicon wafer before the silicon wafer is transferred to the workpiece table, and the center of the silicon wafer can be determined by measuring the center of the silicon wafer. At the current position, the direction of the silicon wafer is determined by measuring the direction of the notch of the silicon wafer. [0003] The current common pre-alignment method is to measure the edge position of the silicon wafer through the senso...

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Problems solved by technology

[0003] The current common pre-alignment method is to measure the edge position of the silicon wafer through the sensor, and the silicon wafer can be rotated once to obtain all the edge positions of the silicon wafer, and the center and direction of the silicon wafer can be obtained by fitting, but due to silicon During the rotation of the wafer, it is inevitable to vibrate in the vertical direction. This vibration will affect the measured value of the edge of the silicon wafer. However, the current edge measurement ignores this vibration, which will eventually affect the centering and Orientation accuracy

[0004] Such as the silicon wafer pre-alignment device described in Chinese patent CN1695695, its disadvantage is that it only performs pre-alignment by measuring the horizontal position of the edge of the silicon wafer, and does not consider the influence of the vibration of the silicon wafer during the rotation process on the measurement accuracy

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