Encapsulating method of high-strength chip

A chip packaging, high-strength technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing the service life of the chip, affecting the normal operation of the chip, and lack of stability of the chip packaging structure, so as to improve the strength and Toughness, multiple protections, and superior performance
CN102403237AInactive Publication Date: 2012-04-04常熟市广大电器有限公司
1 Cites 3 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
常熟市广大电器有限公司
Publication Date
2012-04-04
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention discloses an encapsulating method of a high-strength chip, which mainly comprises the following steps: a) mounting and connecting a base plate, b) mounting and connecting a chip, c) detecting the performance, d) pouring a sealing layer, e) plating a metal layer, f) spraying and coating a heat dissipation layer, and g) detecting a finished product. The invention has the beneficial effects that with the adoption of the encapsulating method of the high-strength chip, the working procedures are reasonable to arrange and are easy to implement; an encapsulating body outside the chip is prepared by a plurality of working procedures in the encapsulating process to form a multi-layered encapsulating structure, thereby realizing the multiple protection to the chip and effectively improving the strength and the toughness of the encapsulating structure; and meanwhile, the good heat radiation performance of the encapsulating structure is also ensured, so that the service performance of the chip is more excellent.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a chip packaging method, in particular to a chip packaging method with high strength and excellent heat dissipation performance, and belongs to the technical field of chip packaging. Background technique

[0002] In the manufacture of integrated circuits, chips are obtained through the steps of wafer fabrication, forming integrated circuits, and cutting wafers. After the integrated circuit of the wafer is fabricated, the chip formed by dicing the wafer can be electrically connected to the carrier outwardly; wherein, the carrier can be a lead frame or a substrate, and the chip can be wire bonded or covered. The method of crystal bonding is electrically connected to the carrier. If the chip and the carrier are electrically connected by wire bonding, then enter into the manufacturing step of filling the encapsulant to form the chip package. Chip packaging technology is a process technology that wraps the chip to avoid contact be...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More