USB (universal serial bus) device structure

Abstract

The invention relates to a USB (universal serial bus) device structure, which comprises a first packaging component (10) and at least one second packaging component (20). The first packaging component (10) includes at least one electronic component (12) which is attached to a substrate (11) and sealed in a first sealing glue body (15), each second packaging component (20) includes at least one electronic component (22) which is attached to a substrate (21) and sealed in a second sealing glue body (25), each second packaging component (20) can be completely and partially sealed by the corresponding first sealing glue body (15), a plurality of metal contacts (13) are arranged on the inner surface (111) of the substrate (11) of the first packaging component (10), a plurality of metal contacts (23) are arranged on the outer surface (212) of the substrate (21) of each second packaging component (20), and the metal contacts (13) of the first packaging component (10) electrically contact with the metal contacts (23) of the second packaging components (20). By the aid of the USB device structure, yield of products can be increased, client delivery term can be shortened, and manufacturing cost and material cost are reduced.

Description

technical field [0001] The invention relates to a USB device structure, in particular to a USB device structure manufactured by dividing chips with different functions or large differences into different packaging components. Background technique [0002] With the advent of the Internet age, the speed of information sharing has been accelerated, and the pace of information technology popularization and progress has also been accelerated. Such as electronic computer (computer), communication (Communications) and consumer-electronics (Consumer-Electronics) products etc. have been widely penetrated into the lives of consumers. [0003] Among them, storage devices, such as flash drives, hard drives or other flash memory-based devices, have high mobility due to their light, thin, short, and small characteristics, and their storage capacity has increased to Tbyte-level capacity. And there is still a trend of continuous increase, so it is increasingly favored by consumers for the ...

AI Technical Summary

Problems solved by technology

[0005] However, in the manufacturing process, if the electrical contact of a certain functional chip component is poor, for example, when the distribution of gold wires is too dense, it is easy to have the disadvantages of wire-sweeping and exposed gold wires.

It is very easy to cause the electrical characteristics of the entire product to be abnormal, which will lead to the failure of the product in the inspection stage.

[0006] From the standpoint of manufacturing products, if the failure rate of products increases, it may be necessary to delay the customer's delivery deadline, increase the time consumption of the manufacturing process, and have a great chance of crowding out products from other production lines, resulting in an increase in manufacturing costs.

In addition, since the packaged product cannot be taken out of the normal electronic components for reprocessing, it also causes waste of materials and relatively increases the cost of materials

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