Wafer defect defection method and system
A detection method and defect technology, which are applied in the directions of optical testing defects/defects, semiconductor/solid-state device testing/measurement, etc., can solve problems such as methods and systems for determining the root cause of defects in non-defective wafers, and achieve product yield, Provides the effect of productivity
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[0024] Hereinafter, specific embodiments of the present invention will be described in detail based on the drawings. The specific embodiments described here are for illustration only, and are not intended to limit the present invention.
[0025] As is well known, a wafer W which is a raw material of an IC device is manufactured through a plurality of processes such as etching and doping. The above-mentioned etching, doping and other processes are carried out on the production machine. The apparatus for processing the wafer W includes a production machine having a reaction chamber for performing the above-mentioned processing, and a robot for transferring the wafer W.
[0026] According to the number of different reaction chambers, the production machines can be divided into By1 group production machines with one reaction chamber, By2 group production machines with two reaction chambers, By3 group production machines with 3 reaction chambers, By4 group of production machines ...
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