Methods, devices, and systems relating to memory cells having a floating body

A memory cell, floating body technology, used in semiconductor devices, electro-solid-state devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as weakened signals, poor data retention, and problems during operation

Active Publication Date: 2014-07-02
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is especially problematic during operation at higher temperatures
Additionally, conventional floating body memory cells suffer from poor data retention during hold, read, and write operations due to loss of charge from the floating body immediately after charge recombination
Also, since conventional floating body memory cells can have small floating bodies that are not configured to hold large amounts of charge, any loss of charge can lead to fluctuating or weakened signal

Method used

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  • Methods, devices, and systems relating to memory cells having a floating body
  • Methods, devices, and systems relating to memory cells having a floating body
  • Methods, devices, and systems relating to memory cells having a floating body

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Embodiment Construction

[0038] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and structural, logical, and electrical changes may be made within the scope of the invention.

[0039] In this description, functionality may be shown in block diagram form in order not to obscure the invention in unnecessary detail. Furthermore, the particular implementations shown and described are examples only and should not be construed as the only ways to practice the invention unless otherwise specified herein. The block demarcations and logical divisions between the various blocks represent specific implementations. It will be readily apparent to those skilled in the ...

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PUM

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Abstract

Methods, devices and systems related to memory cells with floating bodies are disclosed. A memory cell includes a transistor including a drain and a source each formed in silicon and a gate positioned between the drain and the source. The memory cell can also include a bias gate recessed into the silicon and positioned between an isolation region and the transistor and configured to be operatively coupled to a bias voltage. Additionally, the memory cell can include a floating body within the silicon having a first portion adjacent to the source and the drain vertically offset from the bias gate and coupled to the A second portion of the first portion, wherein the bias gate is formed adjacent to the second portion.

Description

[0001] Related Application Cross Reference [0002] This application asserts U.S. Patent Application Serial No. 12 / 419,658 filed April 7, 2009 "Methods, Devices, and Systems Relating to Memory Cell Having a Floating Body)” filing date. technical field [0003] In general, embodiments of the invention relate to memory cells. More particularly, embodiments of the invention relate to memory cells having floating bodies, devices and systems utilizing the memory cells, and methods of forming and operating the memory cells. Background technique [0004] Conventional memory, such as DRAM, may include one transistor and one capacitor. However, there is a limit to the scalability of conventional memory due to the presence of the capacitor (and in particular the size of the capacitor). Accordingly, memories have been developed that contain one transistor (IT) and no capacitor as a memory cell, known as "capacitorless" memories. A capacitorless memory cell may include a floating b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/108H01L21/8242
CPCH01L27/108H01L27/10802H01L29/7841H10B12/20H10B12/00H10B99/00
Inventor 山·D·唐
Owner MICRON TECH INC
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