Unlock instant, AI-driven research and patent intelligence for your innovation.

Airtight type multilayer array type light emitting diode

A light-emitting diode, multi-layer technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of burning, poor structural strength, time-consuming and labor-intensive, etc.

Inactive Publication Date: 2012-04-18
盈勝科技股ふん
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the disadvantage of the prior art is that it cannot be used in environments with high water and moisture content for a long time, and in harsh environments such as deep sea, space or military, because the various layers of the packaging structure are not sealed and bonded, which leads to The airtightness gradually deteriorates, and the internal moisture increases, which may cause the components of the packaging structure to separate from each other or even burn out, so it cannot be used in a humid environment, and the structural strength will also become worse and worse. It can be predicted that the LED that has just been installed It must be replaced in a short period of time. However, in such a harsh environment, if maintenance and installation operations are required from time to time, it is not only time-consuming and labor-intensive, but also poses a great threat to personal safety. Therefore, it must be improved to provide a completely water-blocking A light-emitting diode packaging structure that prevents air from entering, is durable, and maintains the performance of optical components for a long time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Airtight type multilayer array type light emitting diode
  • Airtight type multilayer array type light emitting diode
  • Airtight type multilayer array type light emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The following describes the embodiments of the present invention in more detail in conjunction with the accompanying drawings of the specification, so that those skilled in the art can implement it after studying the specification.

[0014] Nowadays, the application of LED has expanded to various fields, including deep-sea use, space use, harsh industrial use, or even military use. If LED is to be used in the above-mentioned high pressure, high impact force, large amount of moisture or temperature change In environments with severe conditions such as abrupt and severe conditions, it is necessary to improve the tightness of the package structure for stable and long-term operation in the above-mentioned environment. The multilayer array type light emitting diode provided by the present invention is an airtight package structure. Multilayer array type light-emitting diodes.

[0015] See figure 1 , Is a three-dimensional exploded view of the airtight multilayer array light-emitt...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an airtight type multilayer array type light emitting diode which mainly comprises a metal substrate with an airtight metal frame body, wherein the airtight metal frame body and the metal substrate are integrally formed; an airtight sealing frame groove is formed on the top surface of the airtight metal frame body; the airtight metal frame body is penetratively provided with two groups of sealing hole pairs; lead frames can be penetratively arranged in the sealing hole pairs; a package material or an optical unit and the like can be arranged in the airtight metal frame body; the sealing holes are internally sealed with glass or ceramic materials completely; a silica gel layer is formed on a fluorescent layer which can be also arranged in a silica glass cover; the silica glass cover is placed on the top surface of the airtight metal frame body and is jointed and sealed with a sealing frame; a space between the silica glass cover and the fluorescent layer is filled with nitrogen gas, so that water vapor is prevented from entering the airtight metal frame body and a crystal grain protecting layer, an airtight LED (Light Emitting Diode) package structure is formed and further the airtight type multilayer array type light emitting diode is suitable for extreme or dangerous environments.

Description

Technical field [0001] The invention relates to a multi-layer array type light-emitting diode, in particular to a high-intensity airtight multi-layer array type light-emitting diode which completely prevents moisture from entering, is durable and maintains the performance of optical components for a long time. Background technique [0002] The light-emitting principle of LED is based on the inherent characteristics of semiconductors. It is different from the principle of discharge and heating of the previous incandescent tube. Instead, it emits light when the current flows into the PN junction of the semiconductor. Therefore, the LED is called a cold light source. (cold light). Because LED has the advantages of high durability, long life, light weight, low power consumption and no harmful substances such as mercury, it can be widely used in the lighting equipment industry, and it is usually applied in electronic billboards in the form of LED array packaging , Traffic signs and o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/075H01L33/48
Inventor 胡仲孚吴永富刘奎江
Owner 盈勝科技股ふん