Heat dissipation type rigid-flexible combined board and manufacturing method thereof
The technology of a rigid-flex board and a manufacturing method, applied in the field of rigid-flex board, can solve the problems of splitting of aluminum sheets, poor reliability, increased thermal expansion coefficient, etc., and achieve the effect of enhancing the bonding force and preventing the defects of the sliding plate
Active Publication Date: 2013-08-14
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0006]1. The rigid part is supported by the combination of thermosetting adhesive and aluminum sheet. The thermosetting adhesive used is an epoxy film or epoxy modified acrylic adhesive Film, the thermal conductivity is about 0.1 W / m℃, while the thermal conductivity of the aluminum sheet is 190 W / m℃, the thermal conductivity does not match, and it cannot achieve a good heat dissipation function
[0007]2. After the thermosetting adhesive is tested at a high temperature of 288°C for 10 seconds, the thermal expansion coefficient increases, and it is easy to split with the aluminum sheet, resulting in poor reliability defects
Method used
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[0033] The invention provides a heat-dissipating rigid-flex board and its manufacturing method. In order to make the purpose, technical solution and advantages of the invention more clear and definite, the invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0034] A heat-dissipating rigid-flex board provided by an embodiment of the present invention, such as figure 1 As shown, it includes an aluminum sheet 210 as a rigid board, an FPC soft board 220 as a flexible board, and a prepreg 230 disposed between the aluminum sheet 210 and the FPC soft board 220 .
[0035] The prepreg 230 is made of a thermal interface material having two properties of an electrical insulator and a thermal conductor, and the aluminum sheet 210 and the prepreg 230 are die-cut at a ratio of 1:1;...
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The invention discloses a heat dissipation type rigid-flexible combined board and a manufacturing method thereof. The heat dissipation type rigid-flexible combined board comprises a rigid board, a flexible board and a prepreg arranged between the rigid board and the flexible board, wherein the prepreg is made of a thermal interface material with two characteristics of an electrical insulator and a thermal conductor, the rigid board is an aluminum sheet, and the flexible board is an FPC (Flexible Printed Circuit) soft board; the aluminum sheet and the prepreg are formed by punching according to a proportion of 1: 1; the FPC soft board, the prepreg and the aluminum sheet are laminated in sequence from bottom to top; and the FPC soft board, the prepreg and the aluminum sheet which are laminated well are subjected to press fit through a steel plate and a silica gel pad from the upper edge and the lower edge to form the heat dissipation type rigid-flexible combined board. The rigid-flexible combined board provided by the invention has the advantages of high heat dissipation efficiency, stable product performance, simpleness in manufacturing, easiness in implementation and increased product yield.
Description
technical field [0001] The invention relates to the technical field of rigid-flex boards, in particular to a heat-dissipating rigid-flex board and a manufacturing method thereof. Background technique [0002] Rigid-flex board, as the name suggests, is a combination of soft board and hard board. It is a circuit board formed by combining a thin layer of flexible bottom layer and a rigid bottom layer, and then laminating them into a single component. [0003] The rigid-flex board has both a rigid layer and a flexible layer, and is a multilayer printed circuit board. A typical (four-layer) rigid-flex PCB has a polyimide core covered with copper foil on both top and bottom sides. The outer rigid layers consist of single sided FR4 which are laminated into both sides of the flex core to assemble a multilayer PCB [0004] With the increase in the assembly density of electronic products, the rigid-disturbance combination board not only has the dynamic bending assembly characteristi...
Claims
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IPC IPC(8): H05K1/14H05K1/02H05K3/36
Inventor 黄贤权
Owner SHENZHEN KINWONG ELECTRONICS