Z-pin ultralow temperature freezing implantation head and method for preparing foam sandwich structure K-cor of Z-pin ultralow temperature freezing implantation head
A technology of ultra-low temperature freezing and z-pin, which is applied in the new technology field of Z-pin reinforcement of fiber composite materials
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specific Embodiment approach 1
[0016] Specific implementation mode one: combine figure 1 , 2 This embodiment will be described. Place the carbon fiber T300 on the yarn laying device 1, put the prepared Shuangma resin into the dipping tank 3, set the temperature of the glue tank 3, the mold 4 and the post-curing device 5, and set the pultrusion speed of the traction device 6. The carbon fiber passes through the guiding device 2, the dipping tank 3, the mold 4, the post-curing device 5, the traction device 6, and the winding device 7, and is pultruded to obtain a double-horse Z-pin. The obtained Shuangma Z-pin has low curing degree, strength and stiffness, which cannot meet the requirements of implantation. The prepared double-horse Z-pin enters the ultra-low temperature cooling chamber of the implant head through the guide device of the implanter to freeze, and then implants the frozen fiber composite Z-pin into the foam 11 through the implanter. The Z-pin stiffness of the fiber composite material return...
specific Embodiment approach 2
[0017] Specific Embodiment 2: In combination with Specific Embodiment 1, this embodiment will be described. The method in Embodiment 1 is also applicable to Z-pin fiber composite materials suitable for pultrusion resin systems such as epoxy, benzoxazine, phenolic, cyanate and the like.
specific Embodiment approach 3
[0018] Specific Embodiment 3: In combination with Specific Embodiment 1, this embodiment will be described. The method in the first embodiment is also applicable to other types of carbon fibers and other fibers such as Kevlar, glass fibers and boron fibers.
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