Method for removing impurities of vacuum chuck

Abstract

The invention provides a method for removing impurities of a vacuum chuck. In the method, a blowing pump and a two-position three-way valve are additionally arranged in a gas path, and a link for removing the impurities by blowing is added in the midway during a process that the vacuum chuck adsorbs a workpiece twice continuously so that a vacuum loop always keeps clean, t a vacuum pipeline is prevented from blocking by the impurities, the strength of the adsorption force of the vacuum chuck in a long time working state is ensured, and the reliability of equipment operation is improved. With the adoption of the invention, the vacuum chuck is cleaned nearly without disassembling a filter screen, thereby the frequency of shutdown maintenance is reduced, and the production efficiency is improved; and in addition, the invention has the advantages of simple structure and low cost, and the transformation to the traditional equipment is very easy.

Description

technical field [0001] The invention relates to a method for removing impurities from a vacuum suction cup. Background technique [0002] At present, the use of vacuum adsorption to move workpieces has been widely used in various fields, especially in the electronics industry. In the process of making printed circuit boards, after the punching process is completed, there are still sundries on the workpiece, and these sundries are mainly debris generated by punching. From the punching process to the next process, the printed circuit board is transported by vacuum adsorption. During the process of transport, the sundries are often sucked into the vacuum circuit, which affects the vacuum degree of the vacuum circuit. When the sundries accumulate to a certain extent At this time, the area of ​​the airway in the vacuum circuit is getting smaller and smaller, or even blocked, which seriously affects the adsorption force, causing the vacuum suction cup to fail to absorb the produc...

AI Technical Summary

Problems solved by technology

From the punching process to the next process, the printed circuit board is transported by vacuum adsorption. During the process of transport, the sundries are often sucked into the vacuum circuit, which affects the vacuum degree of the vacuum circuit. When the sundries accumulate to a certain extent At this time, the area of ​​the airway in the vacuum circuit is getting smaller and smaller, or even blocked, which seriously affects the adsorption force, causing the vacuum suction cup to fail to absorb the product or fall during the movement after suction

[0003] The filter screens of the existing vacuum suction cups are all set in the pipeline of the vacuum circuit. When debris blocks the filter screen, production needs to be stopped, and the filter screen needs to be removed for cleaning, which is not only time-consuming and laborious, but also seriously reduces production efficiency.

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