Test device with medium-connected heat-conducting layer

Abstract

The invention relates to a test device with a medium-connected heat-conducting layer. The test device is assembled on a test machine and is used for contacting and forcibly tightening at least one to-be-tested element. The test device comprises at least one test arm, a test head and a heat-conducting layer, wherein the test head is arranged at the front end of the test arm; the test head is provided with an action surface and is used for contacting and forcibly tightening the to-be-tested element, thereby performing heat exchange; and a layer of splicing mediums is coated on any peripheral edge between the action surface of the test head and an opposite surface of the heat-conducting layer, so that the heat-conducting layer can be coated on the action surface of the test head. The heat-conducting layer is used for increasing a compact rate of contact between the test head and the to-be-tested element, thereby promoting the efficiency of heat exchange between the action surface of the test head and the to-be-tested element.

Description

technical field [0001] The present invention relates to a test device with a heat conduction layer connected, in particular to a test device with a heat conduction layer connected to a test head. Background technique [0002] Generally, the test head used for detection is installed on a mechanical arm, and the component to be tested is pressed into the test area of ​​the electrical or hierarchical test equipment in the following pressing way, but due to the heat dissipation mechanism of the conventional test head is not effective The integrated circuit components under test have their disadvantages. Therefore, when conducting electrical tests or hierarchical tests, the heat generated by the integrated circuit components under test is easy to accumulate on them, which may easily cause damage to the integrated circuit components under test. damaged. [0003] In order to solve the above-mentioned problems, the industry has installed an additional cooling module on the test hea...

AI Technical Summary

Problems solved by technology

[0002] Generally, the test head used for detection is installed on a mechanical arm, and the component to be tested is pressed into the test area of ​​the electrical or hierarchical test equipment in the following pressing way, but due to the heat dissipation mechanism of the conventional test head is not effective The integrated circuit components under test have their disadvantages. Therefore, when conducting electrical tests or hierarchical tests, the heat generated by the integrated circuit components under test is easy to accumulate on them, which may easily cause damage to the integrated circuit components under test. damaged

[0003] In order to solve the above-mentioned problems, the industry has installed an additional cooling module on the test head to meet the temperature control requirements during the test process. However, if the surface of the component to be tested is uneven or inclined, such as figure 1 As shown, since the surface of the DUT 2 still has irregularities in the microscopic part, or because there is an inclination when inserting, when the test head 1 is pressed down on the DUT 2 to perform the test procedure , the test head 1 will not be in complete contact with the surface of the device under test 2, so the surface that cannot be contacted between the test head 1 and the device under test 2 will form a gap, and the gap will cause the test The heat conduction efficiency of the head 1 is reduced; therefore, if the test head 1 can help overcome the lack of unevenness of the contact surface, have advantages in assembly, and have excellent heat conduction efficiency and the lowest cost to improve This should be an optimal solution for the efficiency of the DUT 2 heat dissipation

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