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Method for improving wire bonding performance

A technology of wire bonding and performance, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of residual pollutants and unsatisfactory bonding performance, and achieve improved bonding performance, Effect of Improving Wire Bonding Capability

Active Publication Date: 2012-05-09
NEW FOUNDER HLDG DEV LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This technology helps improve how wires connect with carriers during manufacturing processes without contaminating them or causing damage from environmental factors such as dirt particles. It involves removing any harmful substances like grease, oil, bacteria, pollen grains, etc., which can affect adhesion between different materials used together. By doing this process prior to wire-bonding, it becomes easier to achieve better quality connections compared to traditional methods involving acid washing steps afterward.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the quality of welded connections when carrying out these steps within the manufacturing flow of electronic components due to environmental concerns associated with handling harmful substances like dirt or impurities introduced into the surfaces of the materials involved.

Method used

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  • Method for improving wire bonding performance
  • Method for improving wire bonding performance
  • Method for improving wire bonding performance

Examples

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Embodiment 1

[0042] (11) Washing

[0043] Rinse the surface of the carrier board with water to remove the dust and some granular substances such as scum on the surface of the carrier board. In this embodiment, it is preferable to use deionized water (DI water) to rinse the surface of the carrier plate. The rinse time is 1.0-5.0 min, preferably 1.5-3.5 min, and most preferably 2.0-3.0 min. The moving speed of the plate in the water tank (or called the speed of water flow) is 0.5-1.5 m / min, preferably 0.8-1.2 m / min.

[0044] (12) Degreasing

[0045] Clean the carrier with an alkaline degreaser (eg MS100 cleaner ALK) to remove most of the organic contaminants such as fingerprints on the surface of the carrier. During degreasing and cleaning, the temperature of the degreasing agent is 25 to 35°C, preferably 20 to 32°C; and / or, the linear velocity of the carrier (ie the flow rate of the alkaline degreasing agent) is 0.5 to 1.5m / min, Preferably 0.8-1.2 m / min; and / or, the oil removal time is 1...

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Abstract

The invention provides a method for improving the wire bonding capability, wherein the method is characterized by carrying out the following steps on a support plate before wire bonding implementation: A. cleaning the support plate; and B. carrying out plasma etching on the surface of the support plate. Through the steps, organics, flour dust, oxides and sulfides on the surface of the support plate can be removed, thus the metal layer surface of the support plate is clean, and the bonding performance of wires and the support plate is improved.

Description

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Claims

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Application Information

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Owner NEW FOUNDER HLDG DEV LLC
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