2results about How to "Improve bonding effect" patented technology

The present disclosure provides a pressure sensor, a manufacturing method of the pressure sensor, an air conditioning device and a vehicle. The pressure sensor comprises a silicon substrate, a plurality of doped leads, a plurality of piezoresistors, a plurality of contact plugs and a sealing cover. The silicon substrate comprises opposite first and second surfaces, and the second surface is formed with a cavity. The plurality of doped leads are located in the silicon substrate and close to the first surface. The plurality of piezoresistors are formed on the first surface of the silicon substrate and correspondingly connected with the plurality of doped leads. The plurality of piezoresistors correspond to the position of the cavity. The plurality of contact plugs are formed on the first surface of the silicon substrate and correspondingly connected with the plurality of doped leads. The sealing cover is buckled on the substrate to form a closed cavity between the substrate, the plurality of piezoresistors are located in the closed cavity, and at least part of the sealing cover is connected to the region between the piezoresistors and the contact plugs on the first surface. The pressure sensor provided by the present disclosure improves the reliability of the pressure sensor.

The application discloses a PCB ink-jet printing anti-diffusion agent and a preparation method and use method thereof, and relates to the technical field of PCB film processing. The PCB ink-jet printing anti-diffusion agent comprises the following components in percentage by mass: 0.15-0.6% of an oil-repellent agent, 0.2-1.0% of a wetting agent, 0.5-2.5% of a stabilizer, 0.1-3.0% of a cosolvent, and the balance of water; the oil-repellent agent is a mixture of dicyclohexane crown ether derivatives and amino naphthalene sulfonic acid derivatives; the wetting agent is a betaine derivative; the stabilizer is a methylene glycol derivative; and the cosolvent is a piperidine alcohol derivative. The PCB ink-jet printing anti-diffusion agent can form an organic layer on the copper surface of a circuit board and the surface of a substrate, can strengthen the bonding force between the copper surface and the substrate surface and ink, can prevent the diffusion of the ink on the copper surface and the substrate surface, and can improve the product qualification rate of the ink-jet printing solder resist process.