Isolation trench film filling structure, semiconductor memory device and preparation method
A technology for isolating trenches and storage devices, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve problems such as easy generation of voids, device failure, and short circuit of metal bit lines, so as to reduce the generation of voids and improve good quality. rate, the effect of expanding the opening aperture
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0064] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0065] In the background technology, for figure 1 The problem of voids 401 appearing in the present invention, the inventors have found through in-depth research that the reason why voids 401 often appear between the prefabricated filling layer 301 and the high-density plasma oxide layer 402 is that after the prefabricated filling material is formed on the semiconductor substrate 100 ,Such as figure 2 and image 3 As shown, the pre...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com