Back bonding platform for superchip

Abstract

The invention discloses a back bonding platform for a superchip. The back bonding platform comprises a substrate, a chip peeling and overturning unit, an X-Y direction movement unit, a multi-degree of freedom bonding head and a mounting platform unit, wherein the chip peeling and overturning unit is used for respectively peeling and overturning a chip on a wafer disk and sending the chip to a to-be-picked position; the multi-degree of freedom bonding head is arranged on a supporting guide rail of the X-Y direction movement unit in a cantilever mode, and has functions of automatically levelling and aligning; the mounting platform unit is used for adsorbing the substrate and matched with the bonding head, so that the chip and the substrate are mutually positioned. In addition, in order to ensure the high-precision movement or matching of units, a plurality of vision positioning systems are configured in the back bonding platform. The back bonding platform can reach micrometer-level alignment accuracy, has the parallel adjusting accuracy of higher than 0.01 degree, and has the advantages of compact structure, convenience for operation and the like, so that the back bonding platform is particularly suitable for back bonding of the superchip.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a flip-chip bonding platform for high-density chips. Background technique [0002] Chip flip-chip bonding technology is a method of preparing connection bumps on the bare chip electrodes, and interconnecting the bumps with the packaging substrate by brazing, hot pressing and other processes with the chip electrodes facing down. Compared with wire bonding technology, flip chip bonding has the advantages of high precision, small footprint of hybrid integrated chips, high I / O density, short interconnection wires, and small lead parasitic parameters. It has become one of the mainstream technologies in the field of chip packaging today. [0003] For some flip-chip bonding equipment that has been developed in the prior art, such as the thermosonic flip-chip bonding machine developed by Central South University, the maximum number of bumps is 40, and the...

AI Technical Summary

Problems solved by technology

However, this passive leveling mechanism requires the leveling action and the bonding action to be completed at the same position, so that the chip will be under pressure during the leveling process, which is easy to cause damage to the chip; in addition, alignment failure may also be caused during the leveling process Defects

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