42 results about "Ti-Cu alloy" patented technology

The invention discloses a nanoporous TiO2 film on a Ti-Cu alloy surface. With thickness of 5 micrometers, the film has a smooth surface which is not damaged, and the nanopores present an interconnected bicontinuous structure appearance. With an aperture of 50-100nm, the nanopores are in uniform distribution. The preparing method of the film consists of: preparing an amorphous Ti30Cu70 alloy strip; coating the two sides of the strip with silica gel; preparing a 30 mass percent nitric acid solution as an electrolyte solution, utilizing a voltage source meter or an electrochemical workstation to conduct a pulsed dealloying process, with the parameters set as the following: an initial voltage of 1V, a pulse amplitude of 300-400mV, a pulse voltage applying time of 0.5s, a stopped voltage applying time of 0.5-1.0s, a cycle period of 7022-10800 times, and an electrode area of 0.8cm<2>. The preparation method of the invention has the advantages of simple preparation process, low cost, no ''impurity'' introduced during preparation, and no danger, thus being suitable for large area production and application.

A preparation method of an anti-microbial type medical porous Ti-Cu alloy having bioactivity comprises the steps of (1) preparing powder, wherein titanium powder, copper powder and magnesium powder are mixed according to a certain mass percentage ratio; (2) conducting ball milling, wherein the mixed powder is placed in a stainless steel ball mill tank for ball milling; (3) conducting blank pressing, wherein the ball milled powder material is mold-pressed into a pressed blank at the pressure of 500-1000 MPa; (4) conducting furnace charging, wherein the obtained pressed blank and a microwave-assisted heating material are placed in a polycrystal mullite fiber heat preservation barrel, and the polycrystal mullite fiber heat preservation barrel is placed in a microwave sintering furnace; (5) obtaining the ideal anti-microbial type medical porous Ti-Cu alloy having the bioactivity through microwave sintering. The preparation method of the anti-microbial type medical porous Ti-Cu alloy havingthe bioactivity has the technical effects that the preparation method is easy and convenient to perform, the sintering period is short, the energy consumption is small, the preparation method is suitable for industrial production, the sintered porous Ti-Cu alloy has excellent bioactivity and anti-microbial property and can be used as repair and substitute materials of bones, joints, artificial tooth roots and other hard tissue.

The invention relates to an aging-reinforced titanium-copper alloy. The aging-reinforced titanium-copper alloy is characterized by being prepared from the compositions in percentage, by weight, 2.0-4.0% of Ti, 0.5-2.0% of Ni, 0.05-0.5% of P and the balance copper and unavoidable impurities. By controlling the matching ratio of Ni to P to Ti, the yield strength of the aging-reinforced titanium-copper alloy is up to 900-1150 MPa, the conductivity is up to 12-22% IACS, and excellent bending machinability, high-temperature softening resistance and welding properties are obtained. The aging-reinforced titanium-copper alloy is especially applicable to the fields of connectors, terminals, relays and the like.

A kind of rotor slot wedge of dynamotor made of Be-Ni-Ti-Cu alloy, the character of it is: the weight percent of the main components are Be 0.10-0.30%, Ni 1.50-2.50%, Ti 0.40-0.60%, Cr 05-0.15%; the weight percent of impure elements: Mn<=0.04%, Pb<=0.01%, Zn<=0.50%, Fe<=0.20%, Sn<=0.20%, Al<=0.04%, Bi<=0.005%, Mg<=0.005%, the rotor slot wedge of dynamotor is made out by smelting, cast, hot forging, cold-forming, heat treatment, and machining technology. The advantage of this patent is that it owns great mechanical property both at normal temperature and high temperature, and great electric ability, the cost of it is low, and it is easy to confect, and the internal soundness is well, and the percent of pass at supersonic flaw detecting is high.

This invention provides a thermal interface material including a film and a heat conduction glue closely adhered to said film, among which, said film is composed of a shape memory alloy possibly containing the nm Ni Ti Cu alloy formed on the base surface by vacuum sputter deposition. In addition, this invention also relates to a manufacturing method for the material. Said material contains nm alloy films with a shape memory function, which can resume the original deposited shape under a heat source temperature to increase the contact area with the radiation device, so the material has fine heat conductivity and conduction efficiency.

The invention discloses a titanium dioxide nano thin film composite material and a constant-current preparation method of the composite material. The constant-current preparation method comprises the steps of: placing an amorphous Ti-Cu alloy in an electrolysis solution, and carrying out dealloying process by utilizing a three-electrode system and adopting a constant-current method, wherein a netted platinum electrode is used as a counter electrode, a saturated calomel electrode is used as a reference electrode, the amorphous alloy Ti-Cu is used as a working electrode, the current density is 0.8-2mA / cm<2>, the dealloying time is 3600-10800s, the electrolysis solution is 20-50wt% nitric acid aqueous solution, and the electrolysis solution temperature is 50-80 DEG C. According to the technical scheme disclosed by the invention, Ti-Cu amorphous alloy strips are placed in the electrolysis solution, and dealloying is carried out by three-electrode system reaction, thus a nano porous thin film structure with uniform pore distribution is prepared, the implementation cost is low, the operation is simple and convenient, the reaction temperature is low and the method is an efficient and economical synthesis method.

This invention discloses a method for producing Ti-Cu alloy material. The Ti-Cu alloy material is produced from Ti 5.8-6.1% and Cu 93.9-94.2% by smelting, casting, and rolling. Besides, a third element (one of Al, Fe, Cr and Cd) 0.5-1% can also be added to form a ternary metal. The method comprises: smelting the above components, casting, homogenizing, hot-rolling, quenching, washing with acid, cold-rolling, and aging. The obtained Ti-Cu alloy material has such advantages as high strength, high elasticity, high wear resistance, high corrosion resistance, and high weldability.

The present invention provides a titanium copper alloy excellent in strength, electrical conductivity and bendability, characterized in that it consists essentially of 1.5 to 2.3% by mass of Ti, balance Cu and inevitable impurities; said alloy having a 0.2% yield strength of 750 MPa or greater; an electrical conductivity of 17% IACS or greater; and a relationship represented by the formula:MBR / t≦0.04×YS−30,in which, YS is a 0.2% yield strength (MPa), and MBR / t is a ratio of a minimum bending radius (MBR; mm) for no cracking when said alloy is subjected to W bend test according to JIS H3130 standard along a transverse direction to a rolling direction, to a thickness (t; mm) of test piece.

The invention discloses a nano-porous material prepared through selective corrosion of a Zr-Ti-Cu alloy and a preparation method thereof. The material takes ZrxTiyCuz as a substrate, wherein x, y andz refer to atom percentage; x is more than 0 and less than 50; y is more than 0 and less than 50; z=50; and x+y=50. A nano-porous copper layer of the porous material is 1 to 3[mu]m in thickness, 20 to40nm in ligament width, and 11 to 30nm in aperture size. In the preparation method, a chemical dealloying method is adopted after smelting; Ti and Zr atoms are removed through selective corrosion with HF acid; and copper atoms are diffused, recombined and agglomerated to form a three-dimensional dual-continuous nano-porous material with a uniform netlike structure. Compared with the prior art, the preparation method only uses a HF solution without any other acid, so that the operation steps are simplified.

The invention provides a copper-copper metal thermal pressing bonding method. The method at least comprises the following steps: first of all, providing a first wafer to be bonded and a second wafer to be bonded, wherein the first water comprises a first substrate, a first passivation layer and a first Ti-Cu alloy film, and the second wafer comprises a second substrate, a second passivation layer and a second Ti-Cu alloy film; then, performgin thermal pressing bonding on the surface of the first Ti-Cu alloy film of the first wafer and the surface of the second Ti-Cu alloy film of the second wafer; and finally, performing annealing processing in a protective gas to enable Ti atoms in the first Ti-Cu alloy film to diffuse towards the surface of the first passivation layer and Ti atoms in the second Ti-Cu alloy film to diffuse towards the surface of the second passivation layer so as to finally form Ti adhesive / barrier layers on the surfaces of the first passivation layer and the second passivation layer, and Cu atoms diffusing towards a bonding surface so as to realize bonding. According to the method provided by the invention, before the bonding, what is needed is only to respectively perform co-sputtering on the two substrates for once, such that the sputtering frequency is reduced by half, the process is relatively simple, the reliability is good, the technical cost is quite low, and finally, the Ti adhesive / barrier layer are formed through diffusion after the annealing processing, and the copper bonding effect is better.

The invention belongs to the technical field of metal materials, and discloses an antibacterial material additive material, a preparation method and application. Titanium or titanium alloy spherical powder and copper spherical powder are mixed according to a specific proportion, or a titanium-copper alloy ingot in a specific proportion is utilized, and spherical alloy powder is prepared through a plasma rotating electrode and a plasma atomization or gas atomization method; raw material powder is processed by using a laser melting or electron beam additive manufacturing technology; heat treatment is carried out on a processed product, the product is cooled in a furnace, and then hot isobaric treatment is carried out; homogenization treatment is carried out; and timeliness processing is carried out. According to the alloy additive manufacturing production method and a post-treatment process, compared with an antibacterial coating, common titanium and titanium alloy can have a long-acting antibacterial effect. A mixed material in a specific proportion can be processed by utilizing the advantages of additive manufacturing, a traditional titanium-based material is endowed with the antibacterial characteristic, and the mechanical property and the antibacterial effect of a part can be balanced through the post-treatment process.

The invention discloses a preparation method of Ni-Ti-Cu alloy tooth arch wires. The material of the tooth arch wires is a Ni-Ti-Cu alloy and comprises, by weight, 50.14% of Ni, 43.54% of Ti and 6.26% of Cu. Ni-Ti-Cu cast ingots are prepared by adoption of vacuum self-consuming electric arc smelting, and then forging, rolling, wire drawing and sizing are conducted to prepare the Ni-Ti-Cu tooth arch wires. The method has the advantages that stress needed by martensite phase variant reorientation is low, thus martensite variant reorientation is easily conducted, and deformation stress or the yield strength under the martensite state is lowered; through adding of the Cu, the yield strength of a base phase B2 can be improved, so that the yield strength difference of the base phase and a martensite phase is increased, and phase change cyclic behavior of the base phase is reinforced; the Ni-Ti-Cu alloy is small in super-elasticity stress lagging and thus is a good super-elasticity material; and in Ni-Ti-Cu, the content of the Cu is, by atom percentage, 5-10% so as to replace Ni, and the raw material cost can further be greatly reduced.

The invention discloses a diamond-magnesium composite heat-radiation material as well as a preparation method and the application thereof. A gradient layer from titanium carbide to a titanium copper alloy is generated on the surface of a diamond to modify and improve interface combination of the diamond and a magnesium substrate, a light diamond-magnesium composite heat-radiation material with high heat conductivity is rapidly synthesized by using a discharge plasma sintering technique, so that the problem of heat radiation caused along with increase of sealing density, of a device of the electronic sealing field, is effectively solved.

The invention discloses a diamond-magnesium composite heat-radiation material as well as a preparation method and the application thereof. A gradient layer from titanium carbide to a titanium copper alloy is generated on the surface of a diamond to modify and improve interface combination of the diamond and a magnesium substrate, a light diamond-magnesium composite heat-radiation material with high heat conductivity is rapidly synthesized by using a discharge plasma sintering technique, so that the problem of heat radiation caused along with increase of sealing density, of a device of the electronic sealing field, is effectively solved.

The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: S(%)≧8.1×[Ti]−17.7 where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.

The invention discloses a titanium-copper alloy explosion-proof material and a preparation method thereof. The material comprises the following components of, in percentage by weight, 30%-40% of titanium-copper alloy, and 60%-70% of graphene; and the titanium-copper alloy comprises the following components of, in percentage by atomic weight, 60%-65% of titanium, 30% of copper, and 5%-10% of nickel. The preparation method comprises the following steps of 1) taking high-purity titanium, copper and nickel as raw material, carrying out high-temperature smelting in an argon atmosphere, grinding toremove oxide skin, and grinding into powder to obtain alloy powder; 2) preparing natural graphite or artificial graphite into powdery graphene; and 3) mixing part of the alloy powder with powdery graphene, loading the mixture into a mold, and sintering to obtain a preform; and placing the preform into a crucible, vacuumizing, heating the remaining alloy powder to be molten, introducing the alloy melt to permeate the preform, and cooling to room temperature. The titanium-copper alloy and the graphene are prepared into the explosion-proof material in the modes of combined mixed sintering, alloymelt infiltration and the like, the overall strength of the material can be improved, and the explosion-proof material has excellent explosion-proof performance.

An object of the present invention is to provide a titanium-copper alloy having excellent strength and good bendability. The titanium-copper alloy is characterized in that it contains 1.0 to 4.5% by mass of Ti, the rest is composed of Cu and unavoidable impurities, and the diameter of the intermetallic compound of Cu and Ti precipitated in the alloy is 3 μm or less, and in the vertical The average number of intermetallic compounds of Cu and Ti with a size of 0.2 to 3 μm precipitated in the alloy in the cross section of the rolling direction is 700 or less per 1000 μm 2 , and the grain size is 10 μm or less.

The invention belongs to the technical field of titanium alloy processing, and particularly relates to a preparation method of a titanium-copper alloy plate. According to the method, high-quality sponge titanium and high-purity electrolytic copper serve as raw materials, a Ti-5Cu alloy plate ingot is formed at a time through an EB electron beam cold bed melting process, volatilization and burning loss of a low-melting-point alloy element Cu are reduced by introducing pure argon or helium protective atmosphere with a certain pressure into a furnace chamber, gas impurities and low-melting-point impurities in the alloy are removed according to the partial pressure principle, and the high-quality sponge titanium and the high-purity electrolytic copper are obtained. The electrode preparation process is omitted, and the production process is simplified. By utilizing the advantages that the Ti-5Cu alloy is small in deformation resistance and good in plasticity when being rolled in a beta-phase region, the Ti-5Cu alloy is rolled in the beta-phase region above the phase transition temperature, it is guaranteed that the deformation amount of the alloy in the beta-phase region reaches 40-90%, and it is avoided that when machining of the beta-phase region is finished, thick grains are reserved in metal, and the mechanical property of the plate is reduced; and a uniform fine grain structure or a basket structure and relatively high mechanical properties can be obtained.

The invention relates to the technical field of titanium and titanium alloy processing, in particular to a preparation method of a titanium-copper alloy plate or strip, which comprises the following steps: selecting a Ti-5Cu alloy casting blank with the thickness of 60-200mm, the width of 600-2000mm and the length of Lmm; analyzing and measuring the phase transition temperature T1 of the Ti-5Cu alloy casting blank; the method comprises the following steps: coating the surface of a Ti-5Cu alloy casting blank with pure titanium or coating the surface of the Ti-5Cu alloy casting blank with an anti-oxidation coating to obtain an anti-oxidation blank, heating the anti-oxidation blank to T2 = T1 + (25-160) DEG C, and keeping the temperature for 10-60 minutes; carrying out hot rolling on the antioxidant blank subjected to heating and heat preservation at the temperature not lower than 700 DEG C; and the hot-rolled blank is subjected to cold rolling, and the titanium-copper alloy plate or strip with the thickness being 0.2-3 mm is obtained. The hot rolling process is carried out in the interval above the phase transition temperature of the Ti-5Cu alloy, it is avoided that when beta-phase region machining is finished, coarse grains are reserved in metal, and in the cold rolling process, rolling defects caused by work hardening and strip cold rolling are eliminated through vacuum annealing or protective atmosphere annealing, the alloy machining plasticity is recovered, and the strip cold rolling machining performance is improved.

The invention belongs to the technical field of titanium alloy heat treatment, and relates to a method for determining the phase transformation point temperature of a titanium-copper alloy and application. The method comprises the following steps: preparing a Ti-5Cu alloy plate ingot sample by taking sponge titanium and copper as raw materials, and carrying out component analysis on the Ti-5Cu alloy plate ingot sample to evaluate the quality of the Ti-5Cu alloy plate ingot sample; if the quality of the Ti-5Cu alloy plate ingot sample is not qualified, preparing again until the quality of the Ti-5Cu alloy plate ingot sample is qualified; and determining the phase transformation point of the Ti-5Cu alloy plate ingot sample with qualified quality by adopting a specific method.

The application discloses a titanium-copper alloy pipe and a preparation method thereof. The titanium-copper alloy pipe comprises the following components in mass percent: Ti: 2.3-3.4%, Cr: 0.02-0.2%, Ni: 0.02-0.5%, Al: 0.15-0.20%, rare earth elements: 0-0.05%, the rare earth elements being at least one of Ce, La, Sc and Y, the balance being Cu and inevitable impurities, and Cu+Ti≥96.0%. The preparation method comprises the following steps: titanium-copper ingot casting, homogenization heat treatment, hole drilling and breaking down, pickling, quenching, rolling, aging hardening treatment, nondestructive testing, water pressure detection, wall thickness measurement and the like. The titanium-copper alloy pipe has a tensile strength of 1100-1250 MPa, a yield strength of 1050-1100 MPa, an elongation after fracture of ≥7.0%, and a hardness HRC of 38-42, and meets the requirements of the strength and corrosion resistance of a pressure-resistant outer cylinder for a logging-while-drilling device.

The present invention provides a copper-copper metal thermocompression bonding method, the method at least includes the steps of: first providing a first wafer to be bonded and a second wafer, the first wafer includes a first substrate , the first passivation layer and the first Ti-Cu alloy thin film, the second wafer includes a second substrate, the second passivation layer and the second Ti-Cu alloy thin film; The surface of the first Ti-Cu alloy film and the surface of the second Ti-Cu alloy film of the second disc are bonded by thermocompression; finally annealing is carried out in a protective gas to make the Ti atoms in the first Ti-Cu alloy film Diffusion to the surface of the first passivation layer, the Ti atoms in the second Ti-Cu alloy film diffuse to the surface of the second passivation layer, and finally form a Ti adhesion / barrier layer on the surface of the first and second passivation layer, and Cu atoms diffuse to the bonding surface to realize bonding. The method of the present invention only needs to co-sputter the two substrates once before bonding, the number of sputtering is reduced by half, the process is relatively simple, the reliability is good, and the process cost is low. Finally, the annealing treatment is diffused to form Ti Adhesion / barrier layer and enables better copper bonding.

The invention relates to an aging-reinforced titanium-copper alloy. The aging-reinforced titanium-copper alloy is characterized by being prepared from the compositions in percentage, by weight, 2.0-4.0% of Ti, 0.5-2.0% of Ni, 0.05-0.5% of P and the balance copper and unavoidable impurities. By controlling the matching ratio of Ni to P to Ti, the yield strength of the aging-reinforced titanium-copper alloy is up to 900-1150 MPa, the conductivity is up to 12-22% IACS, and excellent bending machinability, high-temperature softening resistance and welding properties are obtained. The aging-reinforced titanium-copper alloy is especially applicable to the fields of connectors, terminals, relays and the like.

The invention discloses a low-modulus, high-corrosion-resistant ternary Ni-Ti-Cu alloy and a preparation method thereof. Its main technical scheme is: Ni-Ti-Cu alloy prepared under the conditions of adding Cu element and rapid solidification 26 Ti 49 Cu 25 The elastic modulus of the alloy is around 60 GPa. The present invention has the following beneficial effects: the cooling rate of the present invention using the water-cooled copper crucible method is much lower than other rapid cooling conditions (strip technology), and it is easier to realize in actual industrial production; Cu can play a passivation role on the alloy surface , thereby improving the corrosion resistance of the alloy. In addition, the Cu of the ternary Ni‑Ti‑Cu alloy can be slowly released from the vascular stent, which can play a good role in reducing restenosis symptoms after heart valve surgery.

The invention discloses a high-flexibility copper rod and a preparation method thereof. Copper and titanium are compounded to prepare a copper-based alloy, the flexibility and strength of the material are improved, zirconium is added in the compounding process, titanium is dissolved in the copper in a solid mode, meanwhile, diffusion of the titanium element on a grain boundary can be hindered through addition of zirconium, and thus the heat resistance of the titanium-copper alloy is remarkably improved; the titanium-copper alloy and boron are crushed and then sintered under high pressure, so that secondary recombination of the grain boundary is performed, the boron located at the grain boundary inhibits continuous precipitation of beta-Cu4Ti at the grain boundary during sintering, intergranular fracture is reduced, and the flexibility is improved; the addition of the Mg-Zn-Al alloy inhibits non-uniform nucleation of an equilibrium phase of the titanium-copper alloy at the grain boundary, twin boundary, dislocation and other defects, so that grains are more regular, meanwhile, distribution of a second phase is improved, the hot brittleness of the alloy is eliminated, the metal strength is improved, and the mechanical property of the alloy is improved.

The invention relates to biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and a preparation process. According to the biomedical titanium-copper microsphere assembly type microsphere powder provided by the invention, a body is spherical titanium powder particles, a plurality of cellular copper particles uniformly coat the spherical surface of the body to form a microsphere collection, wherein the particle size of the spherical titanium powder particles is less than 35 microns, and the particle size of the copper particles is less than 3 microns. The titanium-copper alloy prepared from the microsphere powder is composed of an alpha-Ti matrix phase and a Ti2Cu phase, the Ti2Cu phase is finely dispersed and uniformly distributed in the alpha-Ti matrix phase, then the antibacterial property of the material can be improved, the density of the titanium-copper alloy reaches 98% or above, and the compressive yield strength reaches 860 MPa. The preparation process provided by the invention is simple, the production efficiency is high, the alloy cost is relatively low, meanwhile, the nonuniformity of components of the titanium-copper alloy in the traditional preparation method can be obviously improved, and then the mechanical property and the antibacterial property are improved.

The invention discloses a rare earth nitride dispersion strengthening titanium-doped copper alloy and a preparation method thereof. The copper alloy is composed of copper, rare earth nitride and titanium. The copper alloy comprises, by mass, 70%-80% of copper, 0.1%-8% of rare earth nitride and the balance titanium. The method comprises the following steps: blowing rare earth nitride particles into a copper melt, stirring until the rare earth nitride particles are uniformly mixed, spraying titanium powder into a copper alloy melt, cooling the copper alloy melt, carrying out pressure casting to obtain a green body sample, and carrying out degassing and thermal aging treatment on the green body. The copper alloy prepared by the invention has the characteristics of high hardness, high wear resistance and high electric conductivity and heat conductivity.

The invention discloses a preparation process of a hydrogen-storage crack-free zirconium-titanium-copper alloy electrode wafer. The preparation process comprises the steps of 1, adopting metallic titanium, metallic zirconium and metallic copper as raw materials, and preparing a zirconium-titanium-copper alloy through a water-cooling copper crucible electromagnetic induction vacuum suspension smelting method according to the mixing ratio of the raw materials; 2, machining a zirconium-titanium-copper alloy ingot obtained in step 1 into a sample in a certain shape and of a certain size, and conducting a series of treatment on the surface of the zirconium-titanium-copper alloy ingot; and 3, conducting a hydrogen absorption reaction on the zirconium-titanium-copper alloy sample obtained in step2, so that a finished product is obtained. The preparation process starts with the more essential materials and focuses on developing an alloy material excellent in performance; and the alloy material can reduce the bulking and hydrogen embrittlement effects generated due to hydrogenation in the hydrogen absorption process through the pinning effect of certain microelements.