Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Diamond-magnesium composite heat-radiation material as well as preparation method and application thereof

A composite heat dissipation material and diamond technology, applied in the field of diamond-magnesium composite heat dissipation materials and their preparation, can solve the problems of large interface thermal resistance, heat dissipation materials that cannot meet heat dissipation requirements, and difficult infiltration, etc., and achieve excellent thermal conductivity.

Active Publication Date: 2018-05-15
HENAN HUANGHE WHIRLWIND CO LTD
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the field of electronic packaging, traditional heat dissipation materials for electronic packaging have been difficult to meet their heat dissipation needs, so there is an urgent need to develop new heat dissipation materials for electronic packaging
Diamond has a high thermal conductivity and a low thermal expansion coefficient, but it is difficult to prepare a single diamond into a block and the cost is high. For this reason, diamond-reinforced metal matrix composites are known as a hotspot in the field of electronic packaging heat dissipation. At present, , diamond-aluminum, diamond-copper, and diamond-silicon composite heat dissipation materials have been studied more, and these composite materials have some shortcomings, such as the aluminum carbide phase produced at the interface of diamond-aluminum composite materials is easy to hydrolyze, and the diamond-copper composite material The density of the material is higher, and the brittleness of the diamond-silicon composite material is higher, etc.
[0003] Magnesium alloys have been studied as heat dissipation materials for electronic packaging for a long time. However, no relevant research reports on diamond particle-reinforced magnesium-based composites have been found. Interface thermal resistance, in order to solve this problem, we first adopt a new diamond surface modification method, so that a gradient layer modification of titanium carbide to titanium copper alloy is generated on the diamond surface, and then quickly synthesized by spark plasma sintering technology Lightweight and high thermal conductivity diamond-magnesium composite cooling material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diamond-magnesium composite heat-radiation material as well as preparation method and application thereof
  • Diamond-magnesium composite heat-radiation material as well as preparation method and application thereof
  • Diamond-magnesium composite heat-radiation material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] In this embodiment, a diamond-magnesium composite heat dissipation material, the preparation process is as follows:

[0037] The preparation of diamond particles modified by the surface gradient layer, the specific process is: pretreatment of diamond raw materials, diamond surface pretreatment process: ultrasonic cleaning of acetone solution for 20 minutes---absolute ethanol ultrasonic cleaning for 20 minutes---deionized water washing to neutral Properties---wash with dilute nitric acid solution for 15 minutes---wash with deionized water until neutral---dry fully. After roughening and cleaning by pickling, clean diamonds are obtained; and mixed molten salt is prepared, specifically, sodium chloride and potassium chloride are mixed evenly according to the mass ratio of 2:1 to obtain mixed molten salt; according to the mass The ratio is 1:12:0.6:0.2. Weigh diamond, mixed molten salt, metal copper powder with a particle size of 1000 nm and titanium powder with a particle s...

Embodiment 2

[0042] In this embodiment, a diamond-magnesium composite heat dissipation material, the preparation process is as follows:

[0043] The preparation of diamond particles modified by the surface gradient layer, the specific process is: pretreatment of diamond raw materials, roughening and cleaning by pickling, to obtain clean diamonds; and preparation of mixed molten salt, specifically sodium chloride and chloride Potassium is mixed evenly according to the mass ratio of 2:1 to obtain mixed molten salt; according to the mass ratio of 1:10:0.08:0.5, respectively weigh diamond, mixed molten salt, and metal copper powder with a particle size of 30 nanometers and titanium powder with a particle size of 80 nanometers. After mixing these four substances evenly, they were kept in a tube furnace at 900°C under a nitrogen atmosphere for 80 minutes. After cooling to room temperature with the furnace, they were taken out and cleaned and dried to obtain a surface gradient layer modification. ...

Embodiment 3

[0047] In this embodiment, a diamond-magnesium composite heat dissipation material, the preparation process is as follows:

[0048] The preparation of diamond particles modified by the surface gradient layer, the specific process is: pretreatment of diamond raw materials, roughening and cleaning by pickling, to obtain clean diamonds; and preparation of mixed molten salt, specifically sodium chloride and chloride Potassium is mixed evenly according to the ratio of mass ratio of 2:1 to obtain mixed molten salt; according to the ratio of mass ratio of 1:15:0.15:0.1, respectively weigh diamond, mixed molten salt, and metal copper powder with a particle size of 30 nanometers and titanium powder with a particle size of 30 nanometers. After mixing these four substances evenly, heat them in a tube furnace at 920°C under a nitrogen atmosphere for 45 minutes, and take them out after cooling to room temperature with the furnace. After cleaning and drying, a surface gradient layer modifica...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a diamond-magnesium composite heat-radiation material as well as a preparation method and the application thereof. A gradient layer from titanium carbide to a titanium copper alloy is generated on the surface of a diamond to modify and improve interface combination of the diamond and a magnesium substrate, a light diamond-magnesium composite heat-radiation material with high heat conductivity is rapidly synthesized by using a discharge plasma sintering technique, so that the problem of heat radiation caused along with increase of sealing density, of a device of the electronic sealing field, is effectively solved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation substrate materials for electronic packaging, and more specifically relates to a diamond-magnesium composite heat dissipation material and its preparation method and application. Background technique [0002] With the rapid development of the electronic packaging field, the traditional heat dissipation materials for electronic packaging are difficult to meet the heat dissipation needs, so there is an urgent need to develop new heat dissipation materials for electronic packaging. Diamond has a high thermal conductivity and a low thermal expansion coefficient, but it is difficult to prepare a single diamond into a block and the cost is high. For this reason, diamond-reinforced metal matrix composites are known as a hotspot in the field of electronic packaging heat dissipation. At present, , diamond-aluminum, diamond-copper, and diamond-silicon composite heat dissipation materials have been ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C1/10C22C23/00C22C26/00
Inventor 朱聪旭武玺旺李婷婷申峥源岳红伟赵红晓杨晓刚高远浩郑直
Owner HENAN HUANGHE WHIRLWIND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com