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Biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and preparation process

A biomedical and preparation technology, applied in the biomedical field, can solve the problems of titanium-copper alloys that are difficult to achieve alloy homogenization, biomaterials are not sintered densely, and alloy distribution is uneven, and achieve excellent biocompatibility and antibacterial properties , short preparation time and easy process control

Active Publication Date: 2021-05-28
JIANGXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It may be due to the existence of alloy segregation and agglomeration in the process of ball milling alloying, resulting in the problems of non-densification and uneven distribution of alloys in the sintered biomaterials.
[0007] In view of the related technologies mentioned above, the inventor believes that the preparation of titanium-copper alloy has technical defects that it is difficult to achieve alloy homogenization

Method used

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  • Biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and preparation process
  • Biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and preparation process
  • Biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Add 8g of spherical titanium powder (purity 99%) with a particle size of less than 35 microns to 1mol / L sodium hydroxide solution, put it into a constant temperature water bath and heat it to 40°C, and use magnetic stirring to continuously carry out gentle stirring. degreasing and deoxidizing film at 30 rpm for 20 min; filter the powder with a centrifuge, wash with deionized water for 3 times, wash with ethanol for 2 times, and then put it in a vacuum oven at 100°C for drying with a vacuum degree of 1Pa, the time is 10min;

[0048] Configure 200ml electroless copper plating solution, the formula of the plating solution is copper sulfate 9.75g / L; formaldehyde 12.0 ml / L; potassium sodium tartrate 25.0g / L; bipyridine 10ml / L; pH value 12-12.5; Take the dried 8g powder and add it to the prepared chemical plating solution, heat it to 45°C in a constant temperature water bath, keep it warm and stir it continuously with magnetic stirring. The stirring speed is 30rpm, and the pl...

Embodiment 2

[0053] Add 8g of spherical titanium powder (purity 99%) with a particle size of less than 35 microns to 1mol / L sodium hydroxide solution, put it into a constant temperature water bath and heat it to 40°C, and use magnetic stirring to continuously carry out gentle stirring at a stirring speed of 40rpm , remove oil and oxide film for 20 minutes; filter the powder with a centrifuge, wash with deionized water for 3 times, wash with ethanol for 2 times, and then put it in a vacuum drying oven at 100°C for 10 minutes;

[0054] Configure 200ml electroless copper plating solution, the formula of the plating solution is copper sulfate 9.75g / L; formaldehyde 12.0 ml / L; potassium sodium tartrate 25.0g / L; bipyridine 10ml / L; pH value 12-12.5; Take the dried 8g powder and add it to the prepared chemical plating solution, heat it to 45°C in a constant temperature water bath, keep it warm, and use magnetic stirring to continuously carry out gentle stirring. The stirring speed is 30rpm, and the ...

Embodiment 3

[0059] Add 8g of spherical titanium powder (purity 99%) with a particle size of less than 35 microns to 1mol / L sodium hydroxide solution, put it into a constant temperature water bath and heat it to 40°C, and use magnetic stirring to continuously carry out gentle stirring at a stirring speed of 40rpm , degreasing and deoxidizing film for 20 minutes; and cleaning 3 times with deionized water, 2 times with ethanol, and then drying in a vacuum oven at 100 °C for 10 minutes;

[0060] Configure 200ml electroless copper plating solution, the formula of the plating solution is copper sulfate 9.75g / L; formaldehyde 12.0 ml / L; potassium sodium tartrate 25.0g / L; bipyridine 10ml / L; pH value 12-12.5; Take the dried 8g powder and add it to the prepared chemical plating solution, heat it to 45°C in a constant temperature water bath, keep it warm, and stir it continuously with magnetic stirring. The stirring speed is 30rpm, and the plating time is 90min. The whole process Use sodium hydroxide...

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Abstract

The invention relates to biomedical titanium-copper microsphere assembly type microsphere powder, biomedical titanium-copper alloy and a preparation process. According to the biomedical titanium-copper microsphere assembly type microsphere powder provided by the invention, a body is spherical titanium powder particles, a plurality of cellular copper particles uniformly coat the spherical surface of the body to form a microsphere collection, wherein the particle size of the spherical titanium powder particles is less than 35 microns, and the particle size of the copper particles is less than 3 microns. The titanium-copper alloy prepared from the microsphere powder is composed of an alpha-Ti matrix phase and a Ti2Cu phase, the Ti2Cu phase is finely dispersed and uniformly distributed in the alpha-Ti matrix phase, then the antibacterial property of the material can be improved, the density of the titanium-copper alloy reaches 98% or above, and the compressive yield strength reaches 860 MPa. The preparation process provided by the invention is simple, the production efficiency is high, the alloy cost is relatively low, meanwhile, the nonuniformity of components of the titanium-copper alloy in the traditional preparation method can be obviously improved, and then the mechanical property and the antibacterial property are improved.

Description

technical field [0001] This application relates to the field of biomedicine, more specifically, it relates to a biomedical titanium-copper microsphere aggregate microsphere powder, a biomedical titanium-copper alloy and a preparation process. Background technique [0002] As a traditional medical metal material, titanium and titanium alloys are widely used in surgical and medical implants due to their biocompatibility, excellent mechanical properties and corrosion resistance, such as artificial joints, dental implants, bone substitutes and hip replacement. [0003] A more prominent problem of traditional surgical implants and biomedical implants is bacterial infection. Although aseptic manipulation and antibiotics are used during surgery, the morbidity and mortality of bacterial infection are still high. Survey data show that the infection rate of total hip replacement is 1.7% to 3.2%, the infection rate of knee joint is 2.5% to 5.6%, the infection rate of elbow joint is 4%...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02B22F3/02B22F3/10C22C1/04C22C14/00C23C18/40
CPCC23C18/405B22F3/02B22F3/10C22C1/0458C22C14/00B22F2304/10B22F1/065B22F1/17
Inventor 王春明曾路明
Owner JIANGXI UNIV OF SCI & TECH
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