Preparation method for low-temperature curing structure glue film

A curing structure and adhesive film technology, applied in the direction of film/sheet adhesives, adhesives, epoxy glue, etc., can solve problems affecting efficiency, etc., to achieve improved performance, excellent bonding performance, and excellent bonding strength Effect

Inactive Publication Date: 2018-08-14
HENGSHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This requires the use of hot pressing equipment, which not only affects the efficiency of industrial mass production, but also easily generates internal stress problems during the heating and curing process due to the difference in thermal expansion coefficients of different materials.

Method used

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  • Preparation method for low-temperature curing structure glue film
  • Preparation method for low-temperature curing structure glue film

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Effect test

Embodiment

[0016] A low-temperature curing structural adhesive film, in parts by weight, its composition is as follows:

[0017] A component: 30 parts of TDE-85 epoxy resin, 25 parts of AG-80 epoxy resin;

[0018] B component: 45 parts of bisphenol F epoxy;

[0019] C component: 5 parts of polyetheramine, 6 parts of dicyandiamide;

[0020] Component D: 15 parts of core-shell rubber (MX-157), 15 parts of thermoplastic resin;

[0021] Component E: 3 parts of substituted urea, 1 part of DMP-30;

[0022] Component F: 2 parts of titanate, 2 parts of fumed silica.

[0023] The preparation method of this kind of low-temperature curing structural adhesive film is as follows:

[0024] Add component A, component B and component D into the mixing equipment, raise the temperature to 120 °C and keep stirring for 60 minutes to fully dissolve component D and mix evenly, add component F, keep stirring at 90 °C for 30 minutes, cool down to After 45°C, add components C and E, and keep stirring for 20...

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Abstract

The invention provides a preparation method for a low-temperature curing structure glue film. The low-temperature curing structure glue film is prepared from the following components in parts by weight: 25-50 parts of component A, 25-50 parts of component B, 10-25 parts of component C, 5-40 parts of component D, 10-25 parts of component E and 1-25 parts of component F, wherein the component A is selected from at least one of multifunctional epoxy resins, and the component B is selected from one or more of bisphenol epoxy resins. A resin composition is prepared by uniformly mixing the above components A-F, and 100-400 g / m<2> of the low-temperature curing structure glue film is prepared by performing a hot melting method on the obtained resin composition. The method is capable of effectivelyreducing the internal stress easily generated in a heating curing process, and the prepared low-temperature curing structure glue film has an excellent adhesive property and a good gluing result, andcan be extensively applied to board-board and board-core gluing in metal or composite materials.

Description

technical field [0001] The invention relates to a preparation method of a low-temperature curing structural adhesive film. Background technique [0002] In the field of aerospace, the bonding of metal or composite structural parts can avoid the stress concentration of mechanical connections, improve the integrity and rigidity of the structure, improve its fatigue resistance, and at the same time reduce the structural mass and reduce manufacturing costs. [0003] In order to reduce the manufacturing cost of advanced resin-based composite materials and promote their widespread use in aviation, aerospace, weapons, ships and electronics, it is required to reduce the curing temperature as much as possible to reduce the energy consumption of the curing process. However, film epoxy adhesives generally require medium or high temperature curing. That is, it is cured by heating to a temperature of 120°C or even higher. This requires the use of hot pressing equipment, which not only ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C09J7/21
CPCC09J163/00C08L2201/08C08L2203/16C08L2205/025C08L2205/035C09J7/21C09J11/04C09J11/06C08L63/00C08K13/02C08K5/21C08K3/36C08K5/10
Inventor 焦自保钟元伟单瑞俊郭聪聪
Owner HENGSHEN
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