Unlock instant, AI-driven research and patent intelligence for your innovation.

LED heat-dissipation substrate and a manufacturing method thereof

A technology for heat-dissipating substrates and substrates, used in lighting and heating equipment, cooling/heating devices for lighting devices, lighting devices, etc. Effect

Inactive Publication Date: 2012-05-09
GUANGDONG REAL FAITH LIGHTING TECH
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, other heat sources such as constant current power supplies are close to some LEDs, which will significantly reduce the heat dissipation of these LEDs and shorten their life.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED heat-dissipation substrate and a manufacturing method thereof
  • LED heat-dissipation substrate and a manufacturing method thereof
  • LED heat-dissipation substrate and a manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] An LED heat dissipation substrate provided by the present invention and its preparation method will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] Wherein, in the following description, various aspects of the present invention will be described. However, those skilled in the art can only use some or all structures or processes of the present invention to implement the present invention. For clarity of explanation, specific numbers, arrangements and sequences are set forth, but it will be apparent that the invention may be practiced without these specific details. In other instances, well-known features have not been described in detail in order not to obscure the invention.

[0018] In general, the method of the present invention is to use electron beam direct writing (Electron beam direct writing) in combination with nano-electromechanical (NEMS) to make a metal shield of nano-scale micro-lenses, and then dep...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an LED heat-dissipation substrate and a manufacturing method thereof. The LED heat-dissipation substrate structurally comprises an LED wafer or substrate heat-dissipation layer and a nanometer-scale metal composite film coated on the LED wafer or substrate heat-dissipation layer in a sputtering coating way or an evaporation coating way, wherein the LED wafer or substrate heat-dissipation layer is saddle-shaped.

Description

technical field [0001] The invention relates to heat dissipation treatment technology of optical crystals, and more particularly, to an LED heat dissipation substrate and a preparation method thereof. Background technique [0002] The problem of heat dissipation of LEDs is now receiving more and more attention from people. This is because the light decay and lifespan of LEDs are directly related to their junction temperature. If the heat dissipation is not good, the junction temperature will be high and the lifespan will be short. According to the Arrhenius law, every 10°C decrease in temperature will increase the lifespan by 2 times. From the relationship between light decay and junction temperature released by Cree, it can be known that if the junction temperature can be controlled at 65°C, the lifetime of light decay to 70% can be as high as 100,000 hours. But now the actual heat dissipation of LED lamps is far from this requirement, making the life of LED lamps a major ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/00F21V29/00F21V29/56F21V29/70F21Y115/10
Inventor 王培贤苏晋平
Owner GUANGDONG REAL FAITH LIGHTING TECH