Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Aluminum oxide ceramics copper-clad plate and preparation method thereof

A technology of alumina ceramics and ceramic copper clad laminates, which is applied in the field of ceramic metallization, can solve the problems of high equipment requirements, difficult control of process conditions, complex process of alumina ceramic copper clad laminates, etc., and achieve the effect of low temperature

Active Publication Date: 2013-08-21
BYD CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing method for preparing alumina ceramic copper-clad laminates has the defects of complex process, high requirements for equipment, and difficult control of process conditions, so as to provide a method with simple process, low requirements for equipment, and easy control of process conditions. Preparation method of ceramic copper clad laminate and alumina ceramic copper clad laminate thereof

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aluminum oxide ceramics copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0012] According to the preparation method provided by the present invention, the method for forming the copper oxide layer on the surface of the copper plate is to heat the copper plate to 200°C-300°C in the air for oxidation; the oxidation time is not particularly limited, as long as it can It is enough to form a dense copper oxide film layer. In order to make the copper plate well bonded to the ceramic, preferably, the oxidation time is 5-120min. This method is a method for preparing copper oxide known to those skilled in the art. This method is simple and requires low temperature. There is no special limitation on the content of oxygen, and it can be completed in an air environment.

[0013] According to the preparation method provided by the present invention, in order to form a copper oxide layer on only one surface of the copper sheet, before the copper sheet is put into the furnace, a flat glass plate or ceramic plate is placed under it to ensure that the back side is b...

Embodiment 1

[0024] (1) Cut the 0.3mm oxygen-free copper strip into 100*100mm size, after degreasing, pickling, water washing and drying, put a flat glass plate under it and put it into the room which has been heated to 280℃ In the oven, take it out after oxidizing for 5 minutes. The surface not in contact with the glass plate was provided with a 1 micron layer of copper oxide.

[0025] (2) One side of the copper oxide layer and Al with a thickness of 300 μm 2 o 3 The ceramic plates are contacted and stacked to form a composite body;

[0026] (3) Put the stacked body in the atmosphere furnace, raise the temperature to 1050 ° C, and keep it for 10 minutes to completely convert CuO into Cu 2 O, nitrogen with a purity of not less than 99.99% is introduced throughout the process;

[0027] (4) On the basis of step (3), raise the temperature to 1073° C. for sintering, keep the temperature for 10 minutes, and then lower the temperature to room temperature to produce alumina copper-clad lamina...

Embodiment 2

[0029] (1) Cut the 0.3mm oxygen-free copper strip into 100*100mm size, after degreasing, pickling, water washing and drying, put a flat glass plate under it and put it into the room which has been heated to 200℃ In the oven, take it out after oxidation for 120min. The surface not in contact with the glass plate was provided with a 30 micron copper oxide layer.

[0030] (2) One side of the copper oxide layer and Al with a thickness of 1000 μm 2 o 3 The ceramic plates are contacted and stacked to form a composite body;

[0031] (3) Put the stacked body in the atmosphere furnace, raise the temperature to 1000°C, and keep it for 60 minutes to completely convert CuO into Cu 2 O, nitrogen with a purity of not less than 99.99% is introduced throughout the process;

[0032] (4) On the basis of step (3), raise the temperature to 1065° C. for sintering, keep the temperature for 20 minutes, and then cool down to room temperature to produce alumina copper-clad laminate A12. Nitrogen g...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a preparation method for an aluminum oxide ceramics copper-clad plate, comprising the following steps: S1, forming a copper oxide layer on one surface of a copper plate; S2, overlying the copper oxide layer of the copper plate with an aluminum oxide ceramics plate to form a laminated body; S3, heating the laminated body in an inert atmosphere to 1, 000-1, 064 degrees centigrade and performing heat treatment on the body to reduce copper oxide to cuprous oxide to form a ceramics copper-clad plate precursor; S4, sintering the ceramics copper-clad plate precursor to obtain an aluminum oxide ceramics copper-clad plate. The invention also provides an aluminum oxide ceramics copper-clad plate prepared by the method. The preparation method disclosed by the invention can form a layer of copper oxide on the surface of a copper sheet by a common method at a low temperature and has no particular limitation on oxygen content, and can be performed in air environment. The preparation method has advantages of simple process, low requirements on equipment and reduced energy loss.

Description

technical field [0001] The invention belongs to the field of ceramic metallization, and relates to a preparation method of a ceramic copper-clad laminate and a product thereof, in particular to a preparation method of an alumina ceramic copper-clad laminate and the alumina ceramic copper-clad laminate. Background technique [0002] With the development of power electronics technology, the packaging direction of new power electronic devices adopts modularization, and the heat-conducting ceramic copper-clad laminate is the key material. And ceramics (AlN or Al 2 o 3 ) The production of copper clad laminates often adopts the direct copper clad method DBC (Direct Bonding Copper) process, which uses Cu and Cu 2 O produces Cu-Cu between 1064°C-1083°C 2 The O eutectic liquid phase acts as an adhesive between the copper plate and the ceramic plate to bond the two together. The peel strength of the laminated ceramic copper-clad laminate reaches over 60N / cm, and has the advantages...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/02
Inventor 任永鹏林信平张保祥
Owner BYD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com