Inner hole local plating equipment

Abstract

The present invention relates to the technical field of surface treatment equipment, in particular to partial inner hole electroplating equipment for partial electroplating of precious metals in inner holes of workpieces, including a liquid storage bottom tank, a filter, a pump, and an upper tank, and an electric control box is installed next to the upper tank. The electric control box is electrically connected to a DC power supply; the upper tank is equipped with a spray coating module, which includes a water tank, a nozzle installation template, a workpiece installation template, an anode net, a nozzle, and a workpiece conductive voltage tightening device; the workpiece installation template is set There is a mounting hole matching the workpiece. The mounting hole is used to insert the workpiece. The bottom of the mounting hole is provided with an inner hole shielding sleeve for covering the inner hole of the workpiece that does not require electroplating. The mounting hole is also provided with an external sealing shielding sleeve for shielding the outside of the workpiece. It can achieve the purpose of electroplating precious metals at specific positions in the inner hole of the workpiece by using the pressure difference of the solution, and effectively solve the problems of large consumption of precious metals, high cost and low quality of the inner hole coating in the existing electroplating device.

Description

technical field [0001] The invention relates to the technical field of surface treatment equipment, in particular to partial inner hole electroplating equipment used for partial electroplating of precious metals in inner holes of workpieces. Background technique [0002] In the electronics industry, in order to obtain higher connection reliability of circuit connectors, metals such as gold or silver need to be plated on the surface of the contact parts of the connectors to reduce the contact resistance of the contact parts and improve the conductivity. The connector is generally divided into two ends, one end is hole-shaped, and the other end is rod-shaped. Due to the limitation of the technical conditions of the electroplating equipment, the existing electroplating process cannot complete the partial electroplating of a specific part of the inner hole of the workpiece. Only the overall electroplating process can be used to plate the entire inner and outer surfaces of the wo...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to address the deficiencies of the prior art and provide a local electroplating device for the inner hole, which can achieve the purpose of electroplating precious metals at a specific position in the inner hole of the workpiece by using the pressure difference of the solution, and effectively solve the problem of precious metal consumption in the existing electroplating device The problems of large quantity, high cost and low quality of inner hole coating

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