Vertical test equipment for electronic assemblies

A technology for testing equipment and electronic components, applied in static memory, instruments, etc., can solve the problems of increasing test costs, large space, and unfavorable miniaturization of test sites, and achieve the effect of reducing test costs

Inactive Publication Date: 2012-05-16
WELL HANDLE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If many memory modules are to be tested, numerous motherboards must be used, and these motherboards can only be placed horizontally, w

Method used

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  • Vertical test equipment for electronic assemblies
  • Vertical test equipment for electronic assemblies
  • Vertical test equipment for electronic assemblies

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] figure 1 An overall schematic view of the upright testing device according to the first embodiment of the present invention is shown. figure 2 show figure 1 A partial schematic of the upright test setup. image 3 A partial perspective schematic of the upright test apparatus is shown.

[0053] Such as Figures 1 to 3 As shown, the vertical testing device 1 for electronic components of this embodiment includes a box component 10 , a plurality of first motherboard components 20 and a handler 30 . Of course, the upright testing device 1 for electronic components may further include a plurality of additional box components 10 ′. Additional box assembly 10' functions similarly to box assembly 10 to increase test throughput. In the following, only the internal structure of a single box assembly 10 will be used for illustration.

[0054] The first motherboard assembly 20 is disposed in the case assembly 10 . Each first motherboard assembly 20 includes a motherboard 21 ,...

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Abstract

The invention discloses a piece of vertical test equipment for electronic assemblies, comprising a box body assembly, a plurality of first main board assemblies and a processor. The first main board assemblies are disposed in the box body assembly. Each first main board assembly comprises a main board, a first main socket, an adapter plate, a first sub socket and a central processor. The main board is vertically disposed in the box body assembly. The first main socket is disposed on the main board and electrically connected to the main board. The adapter plate is electrically connected to the first main socket and substantially vertical to the main board. The first sub sockets are disposed on the adapter plate. The central processor is disposed on the main board and electrically connected to the main board. The processor plugs a plurality of electronic assemblies in the first sub sockets along a vertical direction to perform a test respectively, and plugs out the electronic assemblies after the test is finished.

Description

technical field [0001] The invention relates to a test device, in particular to a vertical test device for electronic components. Background technique [0002] Traditional memory module testing methods use professional testing equipment to perform testing manually. For example, the memory module can be inserted into the main board, the main board is connected to the display card, the display card is connected to the screen, the memory module is inserted into the memory slot of the main board, and then the main board is powered on for a test. View the test results by means of the test method, and then classify the tested memory modules according to the test results. [0003] Although the memory module can be inserted and removed by the robot arm, the motherboard must be placed horizontally so that the robot arm can insert the memory module into the memory slot on the motherboard. However, the motherboard takes up a considerable amount of horizontal area. If many memory mod...

Claims

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Application Information

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IPC IPC(8): G11C29/56
Inventor 罗文贤
Owner WELL HANDLE TECH
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