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Diamond Wire Saw

A technology of diamond wire saw and diamond particles, which is applied in the direction of metal sawing equipment, stone processing equipment, stone processing tools, etc., can solve the problem of not considering the optimization range, and achieve the effect of suppressing shedding and increasing cutting speed

Inactive Publication Date: 2012-05-30
ILJIN DIAMOND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, conventional diamond wire saws have been used without considering the optimum range for this w-D-x correlation.

Method used

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Embodiment Construction

[0026] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings, but the same reference numerals will be assigned to the same parts as conventional members, and detailed description will be omitted.

[0027] figure 1 is a longitudinal sectional view of a diamond wire saw for explaining the correlation between the cable, the nickel plating layer, and the diamond particles according to a preferred embodiment of the present invention.

[0028] Such as figure 1 As shown, the wire saw based on the embodiment of the present invention is the same as the existing products, and is composed of the following members, that is, a cable 10 having a predetermined length, a plurality of diamond particles 14, and the diamond particles 14 are combined and supported on the cable 10. The binding agent 16.

[0029] At this time, the bonding agent 16 is preferably embodied as an electroplated nickel layer 16 in order to maintain a height for f...

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Abstract

The present invention relates to a diamond wire saw for cutting a silicon ingot for a solar cell, and more particularly, to a diamond wire saw in which the correlation among a wire, an electrodeposited nickel layer, and diamond particles is optimized.

Description

technical field [0001] The present invention relates to a diamond wire saw for cutting silicon ingots for sunlight, in particular to a diamond wire saw which optimizes the correlation between cables-nickel plating layer-diamond particles. Background technique [0002] As a conventional diamond wire saw, for example, a diamond wire saw disclosed in Korean Laid-Open Patent No. 2006-0118392 has been proposed. [0003] Such as figure 2 As shown, the existing diamond wire saw provides a cable 10 and a superabrasive layer 12, wherein the superabrasive layer 12 has a plurality of independently coated diamond particles 14, and the diamond particles 14 are attached using a bonding agent 16 on cable 10. [0004] In addition, a chip pocket is formed between the surface of the bonding agent 16 and the maximum average diameter of the diamond particles 14, and the chip pocket is used as a passage for discharging sawdust generated during cutting to the outside. [0005] When the bonding...

Claims

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Application Information

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IPC IPC(8): B23D61/18B28D1/08C25D5/12
CPCC25D15/02B23D61/185C25D7/00C25D7/0607
Inventor 郑镛华李炯伦柳旼镐
Owner ILJIN DIAMOND
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