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Preparation method of metamaterial and the same

A technology of metamaterials and polymer materials, applied in the field of metamaterials and metamaterials preparation, to achieve the effect of ensuring quality and reducing preparation risks

Active Publication Date: 2012-06-06
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for preparing a metamaterial and a metamaterial, which can avoid the dislocation of the metal microstructure array on the PCB and cannot be modified, thereby reducing the risk of preparation and ensuring the quality of the metamaterial

Method used

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  • Preparation method of metamaterial and the same
  • Preparation method of metamaterial and the same
  • Preparation method of metamaterial and the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] see figure 1 , is a flowchart of a method for preparing a metamaterial provided in Embodiment 1 of the present invention, and the method includes:

[0020] S101: adding a liquid polymer material into the mold, heating and curing to a viscous fluid state, and obtaining a first sheet-like plate.

[0021] Specifically, the liquid polymer material is a thermosetting resin, such as epoxy resin and silicone resin.

[0022] Among them, the volume of polymer material added to the mold is designed according to specific requirements, for example, 48-60 ml; the temperature of heating and curing is generally set according to the type of polymer material, for example, if the polymer material is silicone resin, then The curing temperature is 105-115°C.

[0023] S102: Paste the first PCB board with the metal microstructure array on the first sheet material.

[0024] Wherein, each metal microstructure in the metal microstructure array is an axis paired figure, for example, "I" and i...

Embodiment 2

[0029] see figure 2 , is a flow chart of a method for preparing a metamaterial provided in Embodiment 2 of the present invention, and the preparation method includes:

[0030] S201: forming a metal layer on a substrate.

[0031] Specifically, a method of pasting a layer of metal with an adhesive on the substrate may be adopted; or a method of evaporating a metal layer on the substrate may be adopted.

[0032] S202: Coating a layer of photoresist on the metal layer.

[0033] S203: Perform photolithography on the photoresist according to the preset metal microstructure array pattern.

[0034] Wherein, each metal microstructure in the metal microstructure array is an axis paired figure, for example, "I" and its derivative figures, "big" character and its derivative figures; it can also be a non-axis paired figure, for example, Glyphs and their derivative graphics, parallelograms.

[0035] S204: Transfer the pattern on the photoresist to the metal layer by etching to obtain ...

Embodiment 3

[0043] see image 3 , is a flow chart of a method for preparing a metamaterial provided in Embodiment 3 of the present invention, and the preparation method includes:

[0044] S301: forming a metal layer on a substrate.

[0045] Specifically, a method of pasting a layer of metal with an adhesive on the substrate may be adopted; or a method of evaporating a metal layer on the substrate may be adopted.

[0046] S302: Coating a layer of photoresist on the metal layer.

[0047] S303: Perform photolithography on the photoresist according to the preset metal microstructure array pattern.

[0048] Wherein, each metal microstructure in the metal microstructure array is an axially paired figure, for example, "I" and its derivative figures, "big" and its derivative figures; it can also be a non-axially formed figure, for example, Glyphs and their derivative graphics, parallelograms.

[0049] S304: Transfer the pattern on the photoresist to the metal layer by etching to obtain a fir...

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Abstract

Embodiments of the invention provide a preparation method of a metamaterial. The method comprises the following steps: adding a liquid-state high-molecular material in a mold and heating and curing to a viscous flow state so as to obtain a first flaky sheet material; aligning and pasting a first PCB possessing a metal microstructure array on the first flaky sheet material; further adding the liquid-state high-molecular material in the mold and heating and curing to the viscous flow state, and forming a second flaky sheet material on the first PCB; aligning and pasting a second PCB possessing the metal microstructure array on the second flaky sheet material. The embodiments of the invention also provide the metamaterial prepared by using the above preparation method. By using the method ofthe invention, malposition of the metal microstructure array on the PCB can be modified. Therefore, a preparation risk can be reduced and metamaterial quality can be guaranteed.

Description

【Technical field】 [0001] The invention relates to the technical field of artificial composite materials, in particular to a method for preparing a supermaterial and the supermaterial. 【Background technique】 [0002] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, the limitation of some apparent natural laws can be broken through, so as to obtain the supernormal material function beyond the ordinary nature inherent in nature. The processing of metamaterials is mainly to stack PCB boards with metal microstructure arrays, and fill other media between the layers. In the process of stacking PCB boards with metal microstructure arrays, it is necessary to align each layer of boards, and it is necessary to align the metal microstructure arrays of different PCB board layers. [0003] In t...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/00
Inventor 刘若鹏赵治亚法布里奇亚王文剑黄新政何雪涵
Owner KUANG CHI INST OF ADVANCED TECH
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