Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sputtering target packaging box

A technology for sputtering targets and packaging boxes, applied in packaging, biological packaging, transportation and packaging, etc., can solve problems such as damage to large-scale sputtering targets, waste of storage space, damage to packaging boxes, etc., to ensure quality and safety. , easy to ship and use, the effect of increasing strength

Active Publication Date: 2014-05-07
KONFOONG MATERIALS INTERNATIONAL CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is that the packaging box of large sputtering targets is prone to damage during transportation, thus easily damaging the large sputtering targets
In addition, the present invention also solves the problem of waste of storage space or limited by space caused by existing packing boxes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sputtering target packaging box
  • Sputtering target packaging box
  • Sputtering target packaging box

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention provides a sputtering target packaging box. A protective body is provided in an integrally formed enclosure, and both sides of the protective body are supported on the side plates to increase the strength of the sputtering target packaging box. ;The lock hole on the sputtering target packaging box and the interlocking design of the lock can make the packaging box repeatedly disassembled and installed, which is convenient for shipment and flexible use; the base has at least two isolated I-beams , the load-bearing capacity of the sputtering target packaging box is improved, and the frame-type cover of the above-mentioned packaging box is located on the enclosure, which also improves the load-bearing capacity of the sputtering target packaging box and reduces the damage rate of the target .

[0038] A preferred embodiment of the present invention is a large-scale sputtering target packaging box that uses I-shaped steel as the base and is built with al...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a sputtering target packaging box, which comprises an enclosed box, a protection body positioned in an accommodating space, a bottom plate and a cover plate, wherein the enclosed box comprises side plates which are connected end to end and are integrally molded; the accommodating space is defined by the side plates; two sides of the protection body are supported on the side plates; the bottom plate is arranged on the protection body and is positioned in the enclosed box; the cover plate is arranged on the top of the enclosed box and has a shape of a frame; each frame of the cover plate is provided with a locking hole or a buckle; and the side plates are correspondingly provided with buckles or locking holes which are matched with the locking holes or the buckles of the cover plate. The sputtering target packaging box does not deform due to external force, and the target damage rate is reduced; the packaging box can be repeatedly detached and mounted multiple times and is convenient to carry and flexible to use; and the bearing capacity is high, the packaging box can be laminated in multiple layers, and the storage space of a target is saved.

Description

technical field [0001] The invention relates to the packaging field of semiconductor manufacturing targets, in particular to a sputtering target packaging box. Background technique [0002] In order to prevent the objects from being damaged during transportation, it is usually necessary to package the objects. Various packaging containers are widely used in various industries, such as cardboard wooden boxes, plastic turnover boxes, and plastic turnover baskets for bottling; Packing of objects with the removed covering layer; bundling and packaging of building blocks and other objects with ropes or metal wires, etc. [0003] In the packaging field of sputtering targets for semiconductor manufacturing, the existing sputtering target packaging is generally packaged in ordinary boxes such as hollow boxes, and the sputtering target packaging boxes are generally made of paper or plastic materials. Regardless of whether paper or plastic materials are used, the existing sputtering ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B65D19/06B65D19/38B65D85/30B65D77/02B65D77/26
CPCY02W90/10
Inventor 潘杰姚力军王学泽李响
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com