Liquid crystal epoxy resin with shape memory effect and preparation method and application thereof
An epoxy resin, memory effect technology
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Embodiment 1
[0037] A liquid crystal epoxy shape memory material prepared by the following method:
[0038] Heat and melt 100 parts of epoxy resin biphenol diglycidyl ether at 175°C, then add 20 parts of n-octylamine, mix well, and finally add 15 parts of 4,4'-diaminodiphenylmethane, melt and mix well ; Pour the resulting mixture into a preheated mold at 155°C, solidify at 170°C for 4 hours, then cure at 200°C for 2 hours, and then cool to 20°C to obtain a liquid crystal epoxy shape memory material;
[0039] Said parts are parts by weight.
[0040] The thermal response temperature of the liquid crystal epoxy shape memory material prepared in this embodiment is 90-140°C.
Embodiment 2
[0042] A liquid crystal epoxy shape memory material prepared by the following method:
[0043] Heat and melt 100 parts of epoxy resin (composed of bisphenol diglycidyl ether and bisphenol A epoxy resin E-51 in a mass ratio of 1:2) at 16°C, and then add 1.22 parts of monohydric aliphatic amine Ethylamine, mix well, and finally add 16 parts of 4,4'-diaminodiphenylmethane, melt and mix; pour the resulting mixture into a preheated mold at 140°C, solidify at 40°C for 8 hours, and then Curing for 0.5 hours, then cooling to 25°C to obtain a liquid crystal epoxy shape memory material;
[0044] Said parts are parts by weight.
[0045] The thermal response temperature range of the shape memory of the liquid crystal epoxy shape memory material prepared in this embodiment is 80-140°C.
Embodiment 3
[0047] A liquid crystal epoxy shape memory material prepared by the following method:
[0048] Heat and melt 100 parts of biphenol diglycidyl ether at 190°C, then add 42.59 parts of monohydric aliphatic amine n-hexadecylamine, mix well, and finally add 20 parts of 4,4'-diaminodiphenylmethane, Melting and mixing; pour the resulting mixture into a preheated mold at 170°C, solidify at 100°C for 6 hours, then solidify at 210°C for 1 hour, and then cool to 30°C to obtain a liquid crystal epoxy shape memory material;
[0049] Said parts are parts by weight.
[0050] The thermal response temperature range of the shape memory of the liquid crystal epoxy shape memory material prepared in this embodiment is 70-120°C.
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