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Alkali soluble transparent resin composition

A technology of transparent resin and composition, applied in the field of flexible wiring boards, which can solve the problems of insufficient light transmittance of discoloration resistance and the like

Inactive Publication Date: 2012-06-27
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the reactive epoxy formate compound and the reactive polycarboxylic acid compound of Patent Document 1 have problems of insufficient discoloration resistance and total light transmittance in the visible light region.

Method used

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  • Alkali soluble transparent resin composition
  • Alkali soluble transparent resin composition

Examples

Experimental program
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Embodiment 1～15

[0060] Examples 1-15, Comparative Examples 1-4

[0061]The components shown in the following Table 1 were mixed according to the compounding ratio shown in the following Table 1, and after pre-mixing with a mixer, they were mixed and dispersed at room temperature using a three-roll mill to prepare Examples 1 to 15 and Comparative Example 1. Alkali-soluble transparent resin composition used in ~4. Then, the prepared alkali-soluble transparent resin composition was applied as follows to prepare a test piece. In addition, the numerical value of the compounding ratio in Table 1 represents a mass part.

[0062] 【Table 1】

[0063]

[0064] In addition, the detail of each component in Table 1 is as follows.

[0065] About (A) Carboxyl group-containing photosensitive resin

[0066] - ZFR-1124: Nippon Kayaku Co., Ltd. product, a carboxyl group-containing photosensitive resin obtained using a polyfunctional epoxy resin having a bisphenol F structure.

[0067] · FLX-2089: manufac...

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Abstract

An alkali soluble transparent resin composition is provided to have excellent transmittance of whole rays in visible light area, and yellowing resistance. An alkali soluble transparent resin composition comprises a carboxy group-containing photosensitive resin (A), [alpha] - hydroxyketone based photopolymerization initiator (B), a diluents (C), and an epoxy compound (D).

Description

technical field [0001] The present invention relates to a transparent resin composition suitable for various resists such as solder resists for flexible wiring boards, and a flexible wiring board coated with a cured product obtained by curing the same. Background technique [0002] Currently, curable resin compositions may be used, for example, as solder resist films for flexible wiring boards. Flexible wiring boards are sometimes used as substrates for mounting light-emitting diode elements (LEDs), and in this case, the solder resist film formed on the mounting surface is required to have a function of increasing the reflectance of light from a light source. Furthermore, it is known to mix inorganic white pigments, such as titanium oxide, in order to improve the reflectance etc. of the cured film of curable resin composition. [0003] On the other hand, the solder resist film formed on the mounting surface may be required to have transparency due to the use of the flexible...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/027H05K1/02G06F3/041
CPCH05K3/287G03F7/004G03F7/027G03F7/038G06F3/041C08K5/07C08K5/49C08L63/00C08L75/14
Inventor 冈本吉生谷口裕亮梁仁丁土屋雅裕原嶋启太
Owner TAMURA KK
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