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Method of manufacturing temperature sensor

A technology of temperature sensor and manufacturing method, which is applied in thermometers, instruments, thermometers using electric/magnetic components directly sensitive to heat, etc. Guarantee and other issues, to achieve the effects of accurate measurement, improved measurement accuracy and sensitivity, and simple structure

Active Publication Date: 2013-12-25
CHONGQING WECAN PRECISION INSTR
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Problems solved by technology

The stability over time of temperature sensors of the type described above cannot be guaranteed, since the protective glaze used is electrochemically decomposed when passing through the required measuring circuit at high temperatures, and the material transitions that occur in this case have a negative impact on the properties of platinum. Adverse effects that impair the stability of the sensor and thus the accuracy of the measurement

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  • Method of manufacturing temperature sensor

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] A method for manufacturing a temperature sensor, characterized in that it comprises the steps of:

[0025] 1) Making the substrate: choose a silicon wafer or sapphire, and then engrave a grid on the silicon wafer or sapphire to make a substrate. Compared with the existing ceramic substrate, it is easier to choose a silicon wafer or sapphire. At the same time, the production difficulty is low;

[0026] 2) Deposition: The substrate obtained in step 1) is cleaned with an acidic solution, and then a layer of insulating material is deposited on the surface of the substrate engraved with a grid to make a substrate. The purpose of depositing an insulating layer on the substrate is to avoid When sputtering platinum in one step, since the silicon wafer is a semiconductor, if there is no insulating layer, the platinum layer will conduct...

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Abstract

The invention discloses a method of manufacturing a temperature sensor, which is characterized by including steps of substrate making, deposition, sputtering, primary annealing, primary photoetching, metallization, secondary annealing, secondary photoetching, testing, regulating, scribing, cutting, selecting, lead bonding and packaging. By the method using the silicon wafer or sapphire substrate and respectively sputtering a platinum film resistor and a gold lead layer, the temperature sensor is easy to manufacture. In addition, measuring precision and flexibility of the temperature sensor are improved. The temperature sensor has the advantages of simple structure, safety, reliability, accurate measurement and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a method for manufacturing a temperature sensor. Background technique [0002] Temperature sensors are the core part of temperature measuring instruments, and there are many varieties. They are divided into thermal resistance and thermocouple according to the characteristics of sensor materials and electronic components. Among them, thermal resistance is the most commonly used temperature detector in the medium and low temperature area. Its main features are high measurement accuracy and stable performance. Among them, the measurement accuracy of platinum thermal resistance is the highest. It is not only widely used in industrial temperature measurement, but also made into a standard reference instrument. The temperature measurement principle of thermal resistance is based on the characteristics that the resistance value of conductor or semiconductor changes with t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/18
Inventor 汪松林
Owner CHONGQING WECAN PRECISION INSTR
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