Method for packaging chip based on epoxy resin type adhesive
An epoxy resin and chip packaging technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as chip warping, chip large stress, failure, etc., and achieve unbonded areas and void reduction, Increased stability and reliability, low mechanical stress effect
Inactive Publication Date: 2014-02-26
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
The chip and the packaging substrate are usually bonded by thermal curing. However, since the temperature drops to room temperature after curing, the volume of the adhesive will shrink, causing a lot of stress on the chip; moreover, if the adhesive is in contact with the chip Incompleteness will cause certain bubbles to exist in the adhesive. When the temperature changes, the uneven volume change of the adhesive will also cause greater stress on the chip.
The above situation makes the stability of the chip greatly weakened when the chip is subjected to external vibration and impact, and the chip may warp, deform, or even tear, which will greatly affect the performance of the device or even fail
Method used
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[0015] A chip packaging method based on epoxy resin adhesive, such as figure 1 , 2 shown, including the following steps:
[0016] Step 1: Apply epoxy resin adhesive on the chip mounting position on the polished and cleaned package substrate, place the chip to be packaged on the adhesive, and move the chip back and forth several times laterally to make the package substrate Keep a large contact area with the chip and the adhesive to form a chip-level packaging structure, and then fix the chip-level packaging structure on the vibration table.
[0017] Step 2: Adjust the vibration frequency and vibration amplitude of the vibration table, control the vibration time, and perform contact vibration treatment on the chip-level packaging structure in the plane normal direction of the chip-level packaging structure, so as to remove the epoxy resin adhesive and packaging as much as possible. Air bubbles that may exist between the substrate or chip, and maximize the contact area between...
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The invention relates to a method for packaging a chip based on an epoxy resin type adhesive, belonging to the technical field of packaging electronic components. The method comprises the following steps of: adhering the chip onto an upper chip of a packaging substrate by the epoxy resin type adhesive through frequency-sweeping vibration, and carrying out contact vibration and stress removal vibration treatments. When the frequency-sweeping vibration is carried out on a sheet-level package structure, the chip and the packaging substrate are fully in contact with the epoxy resin type adhesive to the maximum extent, the chip is firmly fixed on the packaging substrate, and thermal residual stress of the chip is lower. According to the method for packaging the chip based on the epoxy resin type adhesive, disclosed by the invention, the chip keeps excellent mechanical stability when bearing temperature change, vibration impaction and the like under the conditions that types and structures of the chip, the packaging substrate and an adhesive are not regulated, thus the reliability of sheet-level package devices is improved.
Description
technical field [0001] The invention belongs to the technical field of packaging of electronic components and relates to a chip packaging method. Background technique [0002] The packaging of electronic components has evolved from the simple glass shell packaging of early vacuum tubes to today's extremely complex advanced systems, and has now developed into one of the core technologies of the new generation of integrated circuits. Due to the Moore's Law that the semiconductor industry follows, the complexity of integrated circuits is increasing, the operating speed is increasing, and the size of chips is becoming smaller and smaller, all of which put forward higher requirements for packaging technology. In the field of integrated circuits and MEMS technology, the cost of packaging will account for 50% to 80% of the total cost of the device. Therefore, it is very important to find a complete and reliable packaging solution for integrated circuits and MEMS systems. [0003] ...
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IPC IPC(8): H01L21/56H01L21/58
Inventor 李伟何敏何剑何少伟蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA