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Apparatus for measuring optical properties of led package

A technology of LED packaging and optical properties, which is applied in the direction of measuring devices, optical radiation measurement, semiconductor/solid-state device testing/measurement, etc., and can solve problems such as limitations and low measurement efficiency

Inactive Publication Date: 2012-07-04
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, measurement of optical properties of separate individual LED packages by using existing optical property measuring equipment is inefficient, and in terms of increasing productivity or improving characteristics of LED packages with a system for measuring optical properties of individual LED packages There are restrictions

Method used

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  • Apparatus for measuring optical properties of led package
  • Apparatus for measuring optical properties of led package
  • Apparatus for measuring optical properties of led package

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Embodiment Construction

[0023] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the shapes and dimensions may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like parts.

[0024] figure 1 is a view illustrating an apparatus for measuring optical properties of an LED package according to an exemplary embodiment of the present invention. refer to figure 1 , an apparatus for measuring optical properties (referred to as 'optical property measuring apparatus') includes a light detection unit 10 , a mounting unit 30 and a voltage application unit...

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Abstract

An apparatus for measuring the optical properties of an LED package includes: a light detection unit detecting light output from a plurality of LED packages of an LED package array in order to measure the optical properties of each of the LED packages; a mounting unit fixing the LED package array thereon when the optical properties thereof are measured; and a voltage application unit applying a driving voltage to the individual LED packages in the LED package array when the optical properties of the LED packages are measured.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2010-0107739 filed with the Korean Intellectual Property Office on Nov. 1, 2010, the disclosure of which is hereby incorporated by reference. technical field [0003] The present invention relates to apparatus for measuring optical properties, and more particularly, to apparatus for measuring optical properties of light emitting diode (LED) packages. Background technique [0004] Generally, LED packages are protected by coating a light-transmitting resin (sealant, sealing material, or sealing paste) to protect the package body, the LED chip mounted on the package substrate, and the electrode connection part (for example, a convex ball) or the bonding wire. and achieved. Depending on the color of the output light of the LED package desired to be achieved, the light-transmitting resin used may be a simple transparent material without phosphor contain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/66
CPCG01J3/506G01J3/0267G01R31/2635G01J3/06G01J3/505
Inventor 尹相福严海龙权忠焕
Owner SAMSUNG ELECTRONICS CO LTD