LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator

A circulator and ferrite technology, applied in the field of LTCC stacked microstrip ferrite circulators, can solve the problems of difficult microwave device integration, lack of flexibility in impedance matching, etc., and achieve the effect of great flexibility

Inactive Publication Date: 2012-07-04
彭龙
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Problems solved by technology

This type of circulator has obvious structural shortcomings and is difficult to integrate with other microwave devices
In the all-magnetic substrate structure, the cent

Method used

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  • LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator
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  • LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator

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Embodiment approach

[0016] The present invention will be described in further detail below in conjunction with the accompanying drawings and an embodiment, and it cannot be assumed that the embodiment of the present invention is limited thereto.

[0017] Such as Figure 5 and Figure 6 As shown, the working center frequency of the LTCC stacked microstrip ferrite circulator provided by the embodiment of the present invention is 3.0GHz, the bandwidth reaches more than 200MHz, the reflection and isolation at the center frequency are better than 35dB, and the insertion loss is lower than 0.5dB , the standing wave ratio is less than 1.1. The circulator is manufactured using the currently mature LTCC process technology.

[0018] A LTCC laminated microstrip ferrite circulator provided by the present invention is as Figure 1 to Figure 4 shown.

[0019] LTCC ferrite layer 2: This layer adopts 10 LTCC barium ferrite cast films with a length of 18.0mm, a width of 16.0mm, a thickness of 70μm, a relative ...

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Abstract

The invention discloses an LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator, belonging to the field of a micro-strip ferrite circulator in a microwave technology. The circulator comprises a metal ground layer, an LTCC ferrite layer, a first LTCC ceramic medium layer, a second LTCC ceramic medium layer, a center junction, a first micro-strip circuit, a metal filling hole and a second micro-strip circuit. The first micro-strip circuit and the center junction are located on the upper surface of the LTCC ferrite layer and are connected with each other; the second micro-strip circuit is located on the upper surface of the first LTCC ceramic medium layer and can be connected with three external ports to carry out feed; and the metal filling holes passes through the first LTCC ceramic medium layer to connect the first micro-strip circuit with the second micro-strip circuit, so as to form a three-dimensional laminated structure. With the adoption of a three-dimensional structure design, the micro-strip circuits are distributed on substrate materials with different types, thereby breaking through structure disadvantages and design disadvantages of the existing micro-strip ferrite circulator and realizing the compatibility with an LTCC technology and components.

Description

technical field [0001] The invention belongs to the field of microwave technology, and relates to an LTCC laminated microstrip ferrite circulator. Background technique [0002] Ferrite circulator is a multi-port microwave passive device in which electromagnetic waves are transmitted in a certain circular direction and isolated in the opposite direction. It is widely used in radar, electronic countermeasures, telemetry and remote control, microwave measurement and microwave communication. . With the development of microwave systems in the direction of miniaturization and high integration, microstrip ferrite circulators have become the current microwave circulators due to their advantages of miniaturization, light weight, low production cost, short production cycle, high reliability and good performance. research hotspots. At present, microstrip ferrite circulators are mainly embedded structures and all-magnetic substrate structures. The embedded microstrip ferrite circulat...

Claims

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Application Information

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IPC IPC(8): H01P1/387
Inventor 彭龙朱兴华
Owner 彭龙
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