Semiconductor package and method of forming the same

A technology for semiconductors and packaging covers, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as semiconductor chip failures

Inactive Publication Date: 2012-07-11
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such EMI can lead to failure of semiconductor chips

Method used

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  • Semiconductor package and method of forming the same
  • Semiconductor package and method of forming the same
  • Semiconductor package and method of forming the same

Examples

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Embodiment Construction

[0038] The inventive concepts are described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the inventive concepts are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals may refer to like elements throughout.

[0039] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0040] It will be understood that when an element or layer is referred to as being "on," "connected to," "coupled to," or "adjacent" another element or layer, it can be directly on the other element or layer. , directly connected to or coupled to or directly adjacent to another element or layer, or intervening elements or layers may be present. figure 1 is a cross-sectional view of a...

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PUM

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Abstract

Disclosed are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a package cap which is capable of radiating high temperatures and performs a shield function preventing transmission of electromagnetic waves into and / or out of the semiconductor package. The semiconductor package including the package cap prevents chip malfunctions and improves device reliability. The package cap is positioned to cover first and second semiconductor chips of a semiconductor package.

Description

technical field [0001] Exemplary embodiments relate to a semiconductor package and a method of manufacturing the semiconductor package. Background technique [0002] With the trend towards small, thin and compact electronic products, small and thin printed circuit boards are required. Together with the portability of electronic devices, the multi-functions and the ability to transmit and receive large amounts of data necessitate complex printed circuit board designs. Thus, demand for multilayer printed circuit boards formed with power supply circuits, ground circuits, signal circuits, etc. has increased. [0003] Semiconductor chips, such as central processing units, power integrated circuits, etc., may be mounted on multilayer printed circuit boards. Such semiconductor chips generate high temperatures when used. High temperatures can lead to failure of semiconductor devices due to overloading. [0004] When a plurality of semiconductor chips are mounted on a printed cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K7/20H05K9/00H05K3/30
CPCH01L2924/01023H01L2924/01082H01L2924/01049H01L23/552H01L23/3677H01L23/3672H01L2224/81005H01L2924/01019H01L2225/06589H01L23/367H01L2224/293H01L2225/06555H01L21/563H01L2924/014H01L2224/29101H01L2224/92225H01L2224/32225H01L2924/0665H01L2224/2919H01L2224/2929H01L2924/01047H01L2224/73204H01L2924/01068H01L23/49827H01L2225/06527H01L2225/06517H01L2225/06513H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H01L23/42H01L23/3128H01L2924/01074H01L25/03H01L2924/01075H01L2224/16225H01L2924/14H01L2924/00
Inventor 任允赫李忠善赵泰济
Owner SAMSUNG ELECTRONICS CO LTD
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