Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber
A LED device and mounting technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of LED circuit disconnection, water ingress, and poor high temperature resistance of the chip device, and achieve a stable and reliable structure.
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[0025] Example one:
[0026] See figure 1 versus figure 2 , A surface-mounted LED device with a soft rubber protection core, including metal lead frames 02 and 03, injection molded plastic 01, cylindrical transparent hard colloid 12 with stepped sides, LED chip 07, bonding glue 09 and Wire 08, injection-molded plastic 01 wraps the metal lead frame 02, in the injection-molded plastic 01, a condensing bowl cup 14 is set, and a part of the metal lead frame 02 is exposed at the bottom of the condensing bowl cup 14. The LED chip 07 is bonded by bonding glue 09 It is connected to the exposed metal lead frame 02 at the bottom of the condensing bowl 14; one end of the wire 08 is connected to the electrode point of the LED chip 07, and the other end is connected to the electrode point on the metal lead frame 02.
[0027] Among them, the structural feature is that the inner wall 15 of the condensing bowl is provided with multiple stepped surfaces 10, the condensing bowl 14 is filled with tr...
Example Embodiment
[0029] Embodiment two:
[0030] See image 3 , A surface-mounted LED device with soft rubber protection inner core, including metal lead frames 02 and 03, injection plastic 01, transparent hard rubber 06, transparent soft rubber 05, LED chip 07, bonding glue 09, wire 08 and Shape hat-shaped transparent hard colloid 13.
[0031] The difference from the first embodiment is that the inner wall of the condensing bowl 14 is a trapezoidal surface, and the inner space of the trapezoidal surface is filled with transparent soft rubber 05 to wrap the LED chip 07 and the wire 08, and the shape is covered by the transparent hard rubber 13 On the transparent soft rubber 05 and fully bond with the injection plastic 01.
Example Embodiment
[0032] Embodiment three:
[0033] See Figure 4 versus Figure 5 The mounted LED device shown in this embodiment is roughly the same as the first embodiment. It also includes metal lead frames 02 and 03, injection molded plastic 01, cylindrical transparent hard colloid 12 with stepped sides, LED chip 07, and Fixed glue 09 and wire 08, injection molded condensing bowl cup 14, the inner wall of the condensing bowl cup 15 is provided with multiple stepped surfaces 10, the condensing bowl cup 14 is filled with transparent soft glue 05 to wrap the LED chip 07 and the connected wires 08, column The transparent hard glue 06 in the transparent hard glue body 12 covers the transparent soft glue 05 and is fully bonded with the injection molded plastic 01.
[0034] The difference between the structure shown in the third embodiment and the first embodiment is the injection-molded plastic structure, including injection-molded plastic 01 and injection-molded plastic 04, that is, the metal lead f...
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