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Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber

A LED device and mounting technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of LED circuit disconnection, water ingress, and poor high temperature resistance of the chip device, and achieve a stable and reliable structure.

Inactive Publication Date: 2012-08-01
李海涛
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing SMD LEDs have poor high temperature resistance, because the injection molding plastic and the transparent filler are bonded surface to surface, and they belong to different types of materials with different thermal shrinkage ratios, so they have been used for a long time in the harsh outdoor environment. Due to different stresses, the joints of transparent fillers, conductive silver glue, gold solder joints and metal lead frames will crack and separate, causing problems such as disconnection of the LED circuit inside the SMT device, water ingress, etc.

Method used

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  • Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber
  • Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber
  • Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] see figure 1 and figure 2 , a surface-mounted LED device with soft rubber protecting the inner core, including metal lead frames 02 and 03, injection plastic 01, columnar transparent hard colloid 12 with stepped sides, LED chip 07, bonding glue 09 and Lead wire 08, plastic injection molding 01 wraps metal lead frame 02, said injection molding plastic 01 is provided with spotlight cup 14, and part of metal lead frame 02 is exposed at the bottom of spotlight cup 14, said LED chip 07 is bonded by bonding glue 09 Junction on the bare metal lead frame 02 at the bottom of the spotlight bowl 14; one end of the wire 08 is connected to the electrode point of the LED chip 07, and the other end is connected to the electrode point on the metal lead frame 02.

[0027] Among them, the structural feature is that the inner wall 15 of the concentrating bowl is provided with a plurality of stepped surfaces 10, the concentrating bowl 14 is filled with transparent soft glue 05 to wrap th...

Embodiment 2

[0030] see image 3 , a surface-mounted LED device with soft rubber protecting the inner core, including metal lead frame 02 and 03, injection plastic 01, transparent hard glue 06, transparent soft glue 05, LED chip 07, bonding glue 09, wire 08 and Outline bamboo hat shape body transparent hard colloid 13.

[0031] The difference from Embodiment 1 is that the inner wall of the concentrating bowl 14 has a trapezoidal surface, and the inner space of the trapezoidal surface is filled with transparent soft glue 05, which is used to wrap the LED chip 07 and the wire 08, and the shape of the bamboo hat is covered with transparent hard glue 13 It is above the transparent soft rubber 05 and fully bonded with the injection molding plastic 01.

Embodiment 3

[0033] see Figure 4 and Figure 5 , the mounting type LED device shown in this embodiment is roughly the same as the first embodiment, and also includes metal lead frames 02 and 03, injection plastic 01, columnar transparent hard colloid 12 with stepped sides, LED chip 07, state Fixed glue 09 and wire 08, injection molded spotlight bowl 14, multiple stepped surfaces 10 on the inner wall 15 of the spotlight bowl, filled with transparent soft glue 05 in the spotlight bowl 14 to wrap LED chip 07 and connected wire 08, column The transparent hard glue 06 in the body-shaped transparent hard glue body 12 covers the top of the transparent soft glue 05 and is fully bonded with the injection molding plastic 01.

[0034] The difference between the structure shown in the third embodiment and the first embodiment is the injection molded plastic structure, including the injection molded plastic 01 and the injection molded plastic 04, that is, the metal lead frame 03 is partially wrapped ...

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Abstract

The invention discloses a surface-mounted type LED (light-emitting diode) device with an inner core protected by flexible rubber. The surface-mounted type LED device comprises injection plastic-rubber, transparent flexible rubber, transparent hard rubber, an LED wafer, a conductive wire, and binding glue. The surface-mounted type LED device with the inner core protected by flexible rubber is characterized in that the injection plastic-rubber wraps part of a metal conductive wire frame; a light-condensing cup is arranged in a plastic-rubber body, and part of the metal conductive wire frame is exposed on the bottom of the cup; the LED wafer is installed on the metal conductive wire frame on the bottom of the light-condensing cup; one end of the conductive wire is connected with an electrode point of the LED wafer, and the other end of the conductive wire is connected with an electrode point on the metal conductive wire frame; the transparent flexible rubber is arranged in a cup interior space above the bottom in the light-condensing cup; and the transparent hard rubber is covered above the transparent flexible rubber and adequately bounded with the injection plastic-rubber. A plurality of step planes are arranged on the inner wall of the light-condensing cup. With the adoption of the surface-mounted type LED device with the inner core protected by flexible rubber disclosed by the invention, the problem that the conductive wire connected with the LED wafer in the previous LED device is easy to fall off is effectively solved; and the interior combination of the surface-mounted type LED device is more compact and firmer, and the surface-mounted type LED device is durable.

Description

technical field [0001] The invention relates to the technical field of patch LEDs, in particular to a surface-mounted LED device with a soft glue protecting the inner core. Background technique [0002] The existing SMD LEDs have poor high temperature resistance, because the injection molding plastic and the transparent filler are bonded surface to surface, and they belong to different types of materials with different thermal shrinkage ratios, so they have been used for a long time in the harsh outdoor environment. Due to different stresses, the joints of transparent fillers, conductive silver glue, gold solder joints and metal lead frames will crack and separate, causing problems such as disconnection of the LED circuit inside the SMT device and water ingress. Contents of the invention [0003] In order to overcome the above-mentioned defects in the prior art, the present invention provides a surface-mounted LED device with soft rubber protecting the inner core, which ef...

Claims

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Application Information

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IPC IPC(8): H01L33/56H01L33/48
CPCH01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/181
Inventor 李海涛
Owner 李海涛
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