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Silicon micro acceleration sensor

An acceleration sensor and acceleration technology, which is applied in the field of inertial sensing, can solve problems such as the complicated process of processing acoustic holes, and achieve the effects of easy adjustment, simplified preparation process, and reduced cost

Inactive Publication Date: 2012-08-22
INST OF ACOUSTICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when this structure is applied to silicon micro-acceleration sensors, the process of processing acoustic holes on the back plate with MEMS technology is still slightly complicated.

Method used

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  • Silicon micro acceleration sensor
  • Silicon micro acceleration sensor
  • Silicon micro acceleration sensor

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Embodiment Construction

[0031] In order to make the advantages and features of the present invention clearer, the present invention will be further described below with reference to the accompanying drawings and examples.

[0032] figure 1 It is a cross-sectional view of the structure of the silicon micro-acceleration sensor of the embodiment of the present invention, which has ventilation grooves on the back plate and the acceleration sensor head. Such as figure 1 As shown, a silicon micro-acceleration sensor in this embodiment includes an acceleration sensing head 10 , two back plates 20 and 30 , and a housing 41 .

[0033] The acceleration sensing head 10 includes a mass block 11 , a frame 13 and a spring 12 connected between the mass block and the frame. Metal coatings can be arranged on the upper and lower surfaces of the mass block to form electrodes.

[0034] figure 2 yes figure 1 Top view of the accelerometer head with the structure shown, as figure 2 As shown, the top view of the acc...

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Abstract

The invention relates to a silicon micro acceleration sensor, which comprises an acceleration sensing head and a back plate. The acceleration sensing head comprises a frame. The back plate and the frame form space for containing the acceleration sensing head. An air hole is formed between the frame and the back plate to ensure that air between the acceleration sensing head and the back plate can freely flow through the air hole. Since the air hole is formed between the frame and the back plate of the silicon micro acceleration sensor, not only can the regulation of system parameters be facilitated, but also the preparation technology is simplified and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of inertial sensing, in particular to a silicon micro-acceleration sensor. Background technique [0002] With the development and maturity of MEMS (micro-electromechanical systems) technology, MEMS acceleration sensors (also known as silicon micro-acceleration sensors) are widely used in automotive electronics and consumer electronics products due to their small size, light weight, low cost, and high integration. A large number of applications have been obtained, and further expansion to the industrial application field has broad market prospects. [0003] The acceleration sensor is generally composed of a detection mass, a spring, and a damper, which constitute a second-order vibration system. Currently existing MEMS acceleration sensors usually detect changes in other physical quantities (such as capacitance or resistance or light intensity or light phase, etc.) caused by the displacement of the mass bloc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/125G01P15/08
Inventor 索智群何庆乔东海
Owner INST OF ACOUSTICS CHINESE ACAD OF SCI