Electronic-paper active substrate and manufacturing method thereof and electronic-paper display screen
A manufacturing method and technology of electronic paper, applied in printed circuit manufacturing, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as limited effect, breakdown, limited pixel area, etc., and achieve area increase, storage capacitance limit expansion, The effect of increased storage capacitance
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no. 1 example
[0056] Next will refer to Figure 2 to Figure 10 The specific implementation manner of the manufacturing method of the electronic paper active substrate of the first embodiment will be described.
[0057] Figure 12 It is a flow chart of the manufacturing method of the electronic paper active substrate according to the first embodiment of the present invention.
[0058] Such as Figure 12 As shown, the manufacturing method of the electronic paper active substrate of this embodiment includes the following steps:
[0059] The gate and first common electrode forming step S1 is used to form the gate (specifically, for example, a metal layer) and the first common electrode on the substrate by, for example, a photolithography process, figure 2 It shows a schematic cross-sectional view of the gate and the first common electrode in the active substrate. It can be seen from the figure that the first common electrode almost occupies most of the area of the pixel unit, and the area...
no. 2 example
[0072] The difference between this embodiment and the first embodiment is that, in the first via hole forming step S9, the method for manufacturing the electronic paper active substrate described in the first embodiment needs to etch the resin passivation layer and the passivation layer to form The first via hole; in this embodiment, the process of the first via hole forming step S9 is simplified, that is, by adding a passivation layer in the passivation layer after the passivation layer forming step S5 or the second via hole forming step S6 Forming the first via hole The first forming step (for example, by etching) is to facilitate obtaining the structure formed with the second via hole and the lower part of the first via hole.
[0073] The most cost-effective process is that the second via hole formation step and the first via hole first formation step can be completed in the same etching step, that is, the formation of both is completed at one time using one mask, such as ...
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