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Vertical electrical-connection structure among different plane circuits and manufacturing method thereof

A technology of electrical connection structure and manufacturing method, applied in the direction of circuits, electrical components, electrical solid devices, etc., to achieve the effects of high through-hole density, high Young's modulus, and low production cost

Active Publication Date: 2015-07-01
江苏中科智芯集成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The present invention provides a vertical electrical connection structure located between different planar circuits and a manufacturing method thereof, aiming at the urgent need for improvement of the existing technology

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  • Vertical electrical-connection structure among different plane circuits and manufacturing method thereof
  • Vertical electrical-connection structure among different plane circuits and manufacturing method thereof
  • Vertical electrical-connection structure among different plane circuits and manufacturing method thereof

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Embodiment Construction

[0043] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0044] The MCM modules or interposers involved in the present invention are different from existing MCM modules or interposers in that they provide an interconnection wiring network embedded in an insulator substrate and enable precise placement of high density vias and transmission lines .

[0045] In the prior art, it may be necessary to change the material composition or electrical and mechanical properties of the substrate containing the through hole, but through the manufacturing method introduced in the present invention, these changes will become very simple; in the prior art, it is possible It is necessary to change the material composition or electromagnetic properties of the through hole and the transmissi...

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Abstract

The invention relates to a vertical electrical-connection structure among different plane circuits, and a manufacturing method of the vertical electrical-connection structure. The vertical electrical-connection structure comprises a first insulating layer, wherein the first insulating layer is provided with a plurality of through holes; conductor columns are arranged in the through holes; the height of each conductor column is same as the depth of each through hole; and the conductor columns are completely embedded in the first insulating layer. The vertical electrical-connection structure has the advantages that the production cost is low, the density of the through holes is high, the positions of the through holes are accurate, and the selection ranges of the material of a substrate and the conductor materials in the through holes are also very wide.

Description

technical field [0001] The invention relates to a vertical electrical connection structure between different planar circuits and a manufacturing method thereof, belonging to the technical field of integrated circuits. Background technique [0002] Typically, a large number of integrated circuits (ICs) need to be interconnected with other integrated circuits. These circuits may be of different types and functions, or of similar types and functions. By using a common substrate, different integrated circuits can be interconnected directly on this substrate. Common substrates are known as multi-chip modules (MCM) or interposer boards. The interposer can support the internal air passages for the purpose of dissipating heat in the closest proximity to the active area, improving system performance and reliability. [0003] In addition, three-dimensional (3D) integration of discrete ICs is a way to improve system performance. In some cases, on the premise of maintaining higher ...

Claims

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Application Information

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IPC IPC(8): H01L23/48H01L23/52H01L21/768H01L21/60
CPCH01L2924/0002
Inventor 丹尼尔 吉多蒂于大全王启东
Owner 江苏中科智芯集成科技有限公司
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