Light-emitting diode element and manufacturing method thereof

Abstract

The invention discloses a light-emitting diode element and a manufacturing method thereof. The light-emitting diode element comprises a packaging substrate, a light-emitting diode chip, at least two lead pins and a packaging rubber body. The packaging substrate comprises a first surface and a second surface opposed to the first surface, and a groove equipped on the first surface. The packaging substrate further comprises a metal base and an insulation layer located on the surface of the metal base. The light-emitting diode chip is equipped on the bottom of the groove. The light-emitting diode chip comprises a first electrical electrode and a second electrical electrode with different electrical properties. The lead pins are equipped on the packaging substrate in a separated way and respectively connected with the first electrical electrode and the second electrical electrode. Each lead pin is connected with the first surface and the second surface. The packaging rubber body wraps the groove and the light-emitting diode chip.

Description

technical field [0001] The invention relates to a light-emitting element, and in particular to a light-emitting diode (LED) element and a manufacturing method thereof. Background technique [0002] Please refer to figure 1 , which is a cross-sectional view illustrating a conventional LED element. The light emitting diode device 100 mainly includes a light emitting diode chip 102 , a package base 104 , a lead frame 106 , a wire 108 , a reflective layer 110 and an encapsulant 112 . Wherein, the lead frame 106 includes guide pins 116 and 118 , and a metal heat conducting block 120 . In addition, the lead pin 118 is connected with the metal heat conducting block 120 , while the lead pin 116 is electrically separated from the metal heat conducting block 120 and the lead pin 118 . [0003] The package base 104 is combined with the lead frame 106 to form a carrier. In this carrier, the package base 104 exposes a portion of each lead 116 and 118 and a portion of the bottom surfa...

AI Technical Summary

Problems solved by technology

However, the use of lasers not only leads to a significant increase in production costs, but also cannot produce smooth and angled reflective bowl sidewalls

As a result, the reflection angle of the light emitted by the LED chip will be poor, which will affect the light shape of the LED element and cause the brightness of the LED element to decrease.

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