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Resin substrate with built-in electronic component and electronic circuit module

An electronic component, resin-based technology, applied in the direction of assembling printed circuits, printed circuit components, circuits, etc. with electrical components, can solve the problems of difficulty in suppressing solder spatter, solder spatter, etc., and achieve the effect of inhibiting the phenomenon of solder spatter.

Inactive Publication Date: 2012-08-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the method disclosed in Patent Document 1 or Patent Document 2 is to improve the adhesion between the resin layer and the electronic component or to improve the adhesion between the resin layer and the center substrate so as to prevent the remelted solder from entering the resin layer and the electronic component and the resin layer and the center substrate. The method of the interface of the substrate does not fundamentally prevent the occurrence of solder spattering
Therefore, when a gap occurs between the resin layer and the electronic component or between the resin layer and the center substrate due to vibration, impact, thermal expansion difference, etc., it is difficult to suppress the solder spatter phenomenon.

Method used

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  • Resin substrate with built-in electronic component and electronic circuit module
  • Resin substrate with built-in electronic component and electronic circuit module
  • Resin substrate with built-in electronic component and electronic circuit module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] exist Figure 1-7 The electronic component built-in resin substrate 100 according to the first embodiment of the present invention is shown in . in addition, Figure 1~6 It is a sectional view showing each process of an example of the manufacturing method of the resin substrate with built-in electronic components 100 which concerns on 1st Embodiment of this invention, Figure 7 It is a cross-sectional view showing the completed electronic component-embedded resin substrate 100 .

[0035] First, if Figure 7 As shown, the electronic component-embedded resin substrate 100 includes a central substrate 1 . Ceramics, resin, or the like can be used for the center substrate 1 . Preference is given to using ceramics.

[0036] Land electrodes 2a, 2b for mounting electronic components and connection electrodes 2c for connecting through portions are formed on the surface of the mounting surface side of the electronic components of the central substrate 1. External connection...

no. 2 approach

[0054] Figure 9 A resin substrate 300 with built-in electronic components according to the second embodiment of the present invention is shown in . in addition, Figure 9 is a cross-sectional view of the resin substrate 300 with built-in electronic components.

[0055] In the electronic component-embedded resin substrate according to the second embodiment, a substrate 21 is further provided on the surface of the sealing member layer 8 opposite to the surface in contact with the resin layer 6 . Connection electrodes 22 a for connecting to the conduction penetration portion 10 are formed on the portion of the substrate 21 in contact with the conduction penetration portion 10 , and wiring is formed on the surface opposite to the surface in contact with the sealing member layer 8 . electrode 22b. Other configurations are the same as those of the electronic component-embedded resin substrate 100 according to the first embodiment.

[0056] In the resin substrate 300 with built-...

no. 3 approach

[0058] exist Figure 10 A resin substrate with built-in electronic components 400 according to the third embodiment of the present invention is shown in . in addition, Figure 10 is a cross-sectional view of the resin substrate 400 with built-in electronic components.

[0059] In the electronic component-embedded resin substrate 400 according to the third embodiment, the substrate 31 is directly bonded to the surface of the resin layer 6 opposite to the surface in contact with the center substrate 1 with an adhesive (not shown). That is, in this embodiment, the substrate 31 functions as a sealing member that seals the hollow penetration portions 7a, 7b. On the surface of the substrate 31 in contact with the resin layer 6, a connection electrode 32a for connecting to the through portion 10 is formed, and a wiring electrode is formed on the surface opposite to the surface in contact with the resin layer 6. 32b. Other configurations are the same as those of the electronic com...

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PUM

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Abstract

The invention discloses a resin substrate with a built-in electronic component and an electronic circuit module. Conventionally, when mounting by reflow soldering a resin substrate with built-in electronic components, the solder that was used in mounting the built-in electronic components is heated, and said solder re-melts and expands, shorting the terminal electrodes of the electronic component; the invention solves this problem. Vias (7a, 7b), one end of which contacts the solder (5a, 5b) which connects to and fixes the built-in electronic component (3), and the other end of which is sealed by a sealing member layer (8), are formed in the resin layer (6). The phenomenon of solder splash is prevented from occurring by allowing the re-melted solder to flow into and remain in the vias (7a, 7b).

Description

technical field [0001] The present invention relates to a resin substrate with built-in electronic components in which electronic components are built in a resin layer, and more specifically relates to a resin substrate with built-in electronic components using solder for mounting the built-in electronic components. [0002] Moreover, this invention relates to the electronic circuit module using the above-mentioned resin substrate with built-in electronic components. Background technique [0003] Conventionally, electronic component-embedded resin substrates in which electronic components are embedded in a resin layer have been used in response to demands such as high-density mounting of electronic components. Figure 12 An example of a resin substrate with built-in electronic components that has been used conventionally is shown in . In this resin substrate 600 with built-in electronic components, the terminal electrodes 104a, 104b of the electronic component 103 are connec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H01L23/12H05K3/34
CPCH01L23/5389H05K1/0272H05K1/185H05K1/186H05K3/3442H05K3/4644H05K2201/0195H05K2201/10636H05K2203/1147H01L2924/0002Y02P70/50H01L2924/00
Inventor 荒井雅司
Owner MURATA MFG CO LTD