Method for adhering bus bar on thin film photovoltaic assembly with conductive silver adhesive

Abstract

The invention relates to a method for adhering a bus bar on a thin film photovoltaic assembly with a conductive silver adhesive, belonging to the technical of a thin film solar cell assembly. According to the technical scheme, two needle cylinders with the same size are placed at the both sides of adhesive spraying equipment for a solar thin film photovoltaic assembly (3); two adhesives with different components are respectively put in the two needle cylinders; the adhesives are pushed into the adhesive spraying equipment for mixing; the two adhesives with different components are mixed to obtain the double-component conductive silver adhesive by adjusting an adhesive pushing pressure and an adhesive spraying speed; the double-component conductive silver adhesive is squeezed through the adhesive spraying head (4) of the adhesive spraying equipment; and uniform and continuous adhesive lines (5) are formed on the front board of the solar thin film photovoltaic assembly. With the adoption of the method provided by the invention, the double-component conductive silver adhesive can be used without being frozen, so as to reduce transportation and storage costs. Meanwhile, abnormal conditions of adhesive dripping and line disconnection, caused by air bubbles of a single-component adhesive, can be avoided, and the technique continuity and the product quality can be ensured; and an adhesive spraying process for a thin film photovoltaic assembly line is optimized, and the double-component conductive silver adhesive is pre-mixed in an online manner.

Description

technical field [0001] The invention relates to a method for bonding bus bars with conductive silver glue on a thin-film photovoltaic module, and belongs to the technical field of thin-film solar cell modules. Background technique [0002] There are three main ways to lead out the electrodes of thin-film photovoltaic modules: bonding bus bars, ultrasonic welding, and using pressure-sensitive bus bars. At present, the conductive silver glue used in the method of bonding bus bar electrodes in the background technology is a single-component conductive silver glue. The glue needs to be transported on dry ice and stored at -40°C, which greatly increases the cost of the conductive silver glue, and the glue is in the process of thawing. Due to the difference in thermal expansion coefficient between the syringe and the silver glue, air bubbles often appear after thawing. The conductive silver glue with bubbles will cause uneven glue lines, glue dripping and disconnection during prod...

AI Technical Summary

Problems solved by technology

At present, the conductive silver glue used in the method of bonding bus bar electrodes in the background technology is a single-component conductive silver glue. The glue needs to be transported on dry ice and stored at -40°C, which greatly increases the cost of the conductive silver glue, and the glue is in the process of thawing. Due to the difference in thermal expansion coefficient between the syringe and the silver glue, air bubbles often appear after thawing. The conductive silver glue with bubbles will cause uneven glue lines, glue dripping and disconnection during production and use, which will affect normal production and product quality.

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