Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Attaching module, apparatus for attaching substrate and method for manufacturing attaching pad

An attachment base and pad technology, applied in the field of manufacturing attachment pads and attachment modules, can solve the problems of polyimide film particle damage, high manufacturing cost, substrate contamination, etc., to achieve improved use efficiency and safety, and improved manufacturing costs. Low, pollution prevention effect

Active Publication Date: 2012-09-19
LIGADP
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First, it consumes a lot of power because DC power must be continuously supplied to the electrostatic chuck while the substrate is attached
Also, when the substrate is attached by static electricity, the electrostatic residue due to the electrode pattern of the electrostatic chuck may cause contamination on the substrate
[0007] Moreover, because the electrostatic chuck has a precise mechanical and electrical structure, its manufacturing cost is very high
Also, in the case of an electrostatic chuck covered with a polyimide film, when the substrate is broken during the process, the polyimide film may be damaged by particles of the substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Attaching module, apparatus for attaching substrate and method for manufacturing attaching pad
  • Attaching module, apparatus for attaching substrate and method for manufacturing attaching pad
  • Attaching module, apparatus for attaching substrate and method for manufacturing attaching pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Hereinafter, an attachment module of an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following exemplary embodiments, for example, an attachment module arranged in a substrate attachment apparatus will be described, but note that the present invention is not limited thereto. Alternatively, the exemplary embodiments of the present invention may be applied to substrate etching equipment, substrate deposition equipment, or other various substrate processing equipment.

[0026] figure 1 is a sectional view showing a substrate attaching apparatus including the attaching module according to the first exemplary embodiment of the present invention. Such as figure 1 As shown, the substrate attach apparatus includes a base frame 10 forming an exterior appearance. Also, a lower cavity 200 is provided within the base frame 10 , and an upper cavity 100 is provided above the lower cavity 200 . Also, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention refers to an attaching module, apparatus for attaching a substrate and method for manufacturing the attaching pad. The attaching module includes a famework and an attaching pad arranged on one side of the framework and capable of attaching with the substrate through attraction among molecules. The attaching pad includes a plurality of attaching parts, a plurality of attaching protrusions of which are arranged in groups. According to an embodiment of the invention, extra power and electric power additional use for stably arranging a substrate are minimized, and compared with a conventional static chuck, service efficiency and security are both improved. Besides, pollution on the substrate caused by residual static electricity when the static chuck is in use can be prevented; compared with the static chuck, the manufacturing costs are lower.

Description

technical field [0001] The present invention provides an attachment module, an apparatus for attaching a substrate, and a method for manufacturing an attachment pad, and more particularly, the present invention relates to an attachment module, an apparatus for attaching a substrate, and a method for manufacturing an attachment pad A method in which a substrate etc. can be attached using the attractive force between molecules. Background technique [0002] With the development of industrial technology, various techniques for processing components such as substrates have been widely used. For example, various substrate processing techniques such as depositing or applying a predetermined material on one side of a substrate, patterning or etching a substrate using a set pattern, attaching two substrates, etc. have been used. [0003] Specifically, various flat panel displays such as liquid crystal displays (LCDs), plasma display panels (PDPs), electroluminescence displays (ELDs...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/683
CPCG02F1/1303G02F1/1339H01L21/683
Inventor 黄载锡
Owner LIGADP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com